In-situ mapping and modeling verification of thermomechanical deformation in underfilled flip-chip packaging using moire interferometry

Materials Research Society Symposium - Proceedings

Volumn 445, Issue , 1997, Pages 167-177

  Dai, Xiang ^a   Kim, Connie ^a   Willecke, Ralf ^a   Ho, Paul S ^a  

^a UNIVERSITY OF TEXAS AT AUSTIN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; FLIP CHIP DEVICES; IMAGE PROCESSING; INTERFEROMETRY; MATHEMATICAL MODELS; MICROELECTRONICS; SHEAR DEFORMATION; STRAIN; THERMAL EFFECTS; THERMAL LOAD;

MOIRE INTERFEROMETRY; THERMOMECHANICAL DEFORMATION;

ELECTRONICS PACKAGING;

EID: 0031374940     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)