Analysis of flip-chip packages using high resolution moire interferometry

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 979-986

  Miller, Mikel R ^a   Mohammed, Ilyas ^a   Dai, Xiang ^a   Jiang, Ning ^a   Ho, Paul S ^a  

^a UNIVERSITY OF TEXAS AT AUSTIN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFRACTION GRATINGS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; INTERFEROMETRY; MOIRE FRINGES; RELIABILITY; SOLDERED JOINTS; STRAIN; STRESS ANALYSIS; THERMAL STRESS;

CONTOUR MAPS; FLIP CHIP PACKAGES; HIGH RESOLUTION MOIRE INTERFEROMETRY; INTERFERENCE PATTERNS; SOLDER BUMP PITCH; STRAIN SINGULARITY ANALYSIS; THERMAL DISPLACEMENTS; THERMALLY INDUCED STRAIN;

ELECTRONICS PACKAGING;

EID: 0032657587     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (5)