Real-time monitoring and simulation of thermal deformation in plastic package

Journal of Electronic Packaging, Transactions of the ASME

Volumn 120, Issue 2, 1998, Pages 160-165

  Zhu, J ^a   Zou, D ^b   Liu, S ^b  

^a NOKIA RESEARCH CENTER   (United States)

^b Wayne State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAMERAS; CHARGE COUPLED DEVICES; COMPUTER SIMULATION; FINITE ELEMENT METHOD; INTERFEROMETRY; MOIRE FRINGES; PLASTICS APPLICATIONS; REAL TIME SYSTEMS; THERMAL CYCLING; THERMAL STRESS;

PLASTIC PACKAGES; THERMAL DEFORMATION;

ELECTRONICS PACKAGING;

EID: 0032096633     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792609     Document Type: Article

References (15)

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