RESOLVING DEFORMATION FIELD NEAR CORNERS AND INTERFACES BY PHASE SHIFTING MOIRE INTERFEROMETRY

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 1997-K, Issue , 1997, Pages 69-76

  Zou, Daqing ^a   He, Xiaoyuan ^a   Liu, Sheng ^a   Guo, Yifan ^b   Dai, Fulong ^c  

^a Wayne State University   (United States)

^b MOTOROLA INC   (United States)

^c TSINGHUA UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; FLIP CHIP DEVICES; IMAGE PROCESSING; INTERFEROMETRY; MICROSTRUCTURE;

DEFORMATION FIELD; FAILURE INITIATION; LAYERED STRUCTURES; MEASUREMENT TECHNIQUES; MICROSTRUCTURE EVOLUTIONS; PHASE SHIFTING MOIRE INTERFEROMETRY; PHASE-SHIFTING TECHNIQUE; STRAIN CONCENTRATION; STRAIN GRADIENTS; STRESS/STRAIN;

DEFORMATION;

EID: 0343480496     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE1997-1229     Document Type: Conference Paper

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