Materials impacts on micro-opto-electro-mechanical systems

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4178, Issue , 2000, Pages 30-41

  Cowan, William D ^a  

^a AIR FORCE RESEARCH LABORATORY   (United States)

Author keywords

Mems; Micro electro mechanical systems; Micro opto electro mechanical systems; Micromirrors; Moems

Indexed keywords

ADAPTIVE OPTICS; DEPOSITION; FILM PREPARATION; MATERIALS PROPERTIES; MECHANICS; MOEMS; PROCESS CONTROL; ROCKS;

CHARACTERIZATION TECHNIQUES; MICRO OPTICAL ELECTRO-MECHANICAL SYSTEMS; MICRO OPTO ELECTRO MECHANICAL SYSTEMS; MULTILAYER STRUCTURES; PROCESS REPEATABILITY; RESIDUAL STRESS GRADIENTS; THIN-FILM CHARACTERIZATION; WAFER CURVATURE MEASUREMENT;

THIN FILMS;

EID: 0001906735     PISSN: 0277786X     EISSN: 1996756X     Source Type: Conference Proceeding    
DOI: 10.1117/12.396478     Document Type: Conference Paper

References (16)

1. D. A. Koester, R. Mahadevan, A. Shishkoff, and K. W. Markus, SmartMUMPs Design Handbook, Revision 5.0, http://www.memsrus.comlcronos/svcsmumps.html.
2. T. Bifano, J. Perreault, R. Mali, and M. Horenstein, "Microelectromechanical deformable mirrors", IEEE Journal ofSelected Topics in Quantum Electronics, Vol. 5, No. 1, 1999.
3. W. D. Cowan, V. M. Bright, M. K. Lee, J. H. Comtois, and M. A. Michalicek, "Design and testing of polysilicon surface-micromachined piston mirror arrays', SPJE, Vol. 3292, pp. 60-70, 1998.
4. G. G. Stoney, "The tension ofmetallic films deposited by electrolysis", Proc. Roy. Soc. (London), Vol. 9, pp. 172-175, 1909.
5. H. Guckel, T. Randazzo, and D. W. Burns, "A simple technique for the determination of mechanical strain in thin films with applications to polysilicon", J. Appl. Phys., Vol. 57, No. 5, pp. 1671-1675, March 1985.
6. H. Guckel, D. Burns, C. Rutigliano, E. Lovell, and B. Choi, "Diagnostic microstructures for the measurement of intrinsic strain in thin films", J. Micromech. Microeng., Vol. 2, pp. 86-95, 1992.
7. w. Fang and J. A. Wickert, "Post buckling ofmicromachined beams", J. Micromech. Microeng., Vol. 4, pp. 116-122, 1994.
8. J. C. Marshall, D. T. Read, and M. Gaitan, "Analysis of fixed-fixed beam test structures", SPIE, Vol. 2880, pp. 46-55, October, 1996.
9. B. P. van Drieenhuizen, J. F. L. Goosen, P. J. French, and R. F. Woiffenbuttel, "Comparison of techniques for measuring both compressive and tensile stress in thin films", Sensors and Actuators, A 37-38, pp. 756-765, 1993.
10. Y. B. Gianchandani and K. Najafi, "Bent-beam strain sensors", IEEE Journal of Microelectromechanical Systems, Vol. 5, No. 1, pp. 52-58, March, 1996.
11. E. Obermier, "Mechanical and thermophysical properties of thin film materials for MEMS: Techniques and devices", Mat. Res. Soc. Symp. Proc., Vol. 444, pp. 39-57, 1997.
12. W. D. Cowan, V. M. Bright, A. A. Elvin, and D. A. Koester, "Modeling of stress-induced curvature in surfacemicromachined devices", SPIE, Vol. 3225, pp. 56-66, September, 1997.
13. M. C. Roggeman, V. M. Bright, B. M. Welsh, S. R. Hick, P. C. Roberts, W. D. Cowan, and J. H. Comtois, "Use of micro-electro-mechanical deformable mirrors to control aberrations in optical systems: Theoretical and experimental results", Opt. Eng., Vol. 36, No. 5, pp. 1326-1338, May 1997.
14. N. Honda, F. Shoji, S. Kidoguchi, Y. Hamada, M, Nagata and K. Oura, "In situ stress measurements of sputterdeposited films", Sensors and Actuators, A 62, pp. 663-667, 1997.
15. S. T. Amimoto, D. J. Chang, and A. D. Birkitt, "Stress measurements in MEMS using Raman spectroscopy", SPIE, Vol. 3512, pp. 123-127, 1998.
16. I. De Wolf, H. E. Maes, and S. K. Jones, "Stress measurements in silicon devices through Raman spectroscopy: Bridging the gap between theory and experiment", J. Appi. Phys., Vol. 79, No. 9, May 1996.