Activation energy of electromigration in copper thin film conductor lines

Materials Research Society Symposium - Proceedings

Volumn 428, Issue , 1996, Pages 55-60

  Gladkikh, A ^a   Lereah, Y ^a   Karpovski, M ^a   Palevski, A ^a   Kaganovskii, Yu S ^a  

^a TEL AVIV UNIVERSITY   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; COPPER; DIFFUSION IN SOLIDS; ELECTROMIGRATION; GRAIN BOUNDARIES; SCANNING ELECTRON MICROSCOPY; TRANSMISSION ELECTRON MICROSCOPY;

COPPER THIN FILM CONDUCTOR LINES;

THIN FILMS;

EID: 0030411096     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-428-55     Document Type: Conference Paper

References (20)