Applications of layer-by-layer polymer stereolithography for three-dimensional high-frequency components

IEEE Transactions on Microwave Theory and Techniques

Volumn 52, Issue 11, 2004, Pages 2567-2575

  Liu, Bosui ^a,b   Gong, Xun ^c   Chappell, William J ^a  

^a PURDUE UNIVERSITY   (United States)

^b KVH Industries Inc   (United States)

^c UNIVERSITY OF MICHIGAN   (United States)

Author keywords

Cavity resonators; Embedded packaging; Fabrication tolerance; Layer by layer three dimensional (3 D) fabrication; Metal loss; Narrow bandpass filter; Stereolithography

Indexed keywords

BANDPASS FILTERS; BANDWIDTH; CAVITY RESONATORS; COMPUTER AIDED DESIGN; HELICAL ANTENNAS; LAYERED MANUFACTURING; MICROWAVES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; NATURAL FREQUENCIES; POLYMERIZATION; SILICON WAFERS;

EMBEDDED PACKAGING; FABRICATION TOLERANCE; METAL LOSS; POLYMER STEREOLITHOGRAPHY;

LITHOGRAPHY;

EID: 9244236544     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMTT.2004.837165     Document Type: Conference Paper

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