W-band micromachined circuit combining networks

IEEE Transactions on Microwave Theory and Techniques

Volumn 50, Issue 6, 2002, Pages 1647-1651

  Herrick, Katherine J ^a,b   Katehi, Linda P B ^a,c  

^a UNIVERSITY OF MICHIGAN   (United States)

^b RAYTHEON COMPANY   (United States)

^c PURDUE UNIVERSITY   (United States)

Author keywords

Micromachining; Microwave circuits; Packaging

Indexed keywords

ELECTRIC IMPEDANCE; ELECTRIC LOSSES; INTERCONNECTION NETWORKS; MICROMACHINING; TRANSMISSION LINE THEORY; WAVEGUIDE JUNCTIONS; WAVEGUIDES;

MICROMACHINED INTERCONNECTS;

MICROWAVE CIRCUITS;

EID: 0036601984     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMTT.2002.1006429     Document Type: Article

References (12)

1. W-band micromachined finite ground coplanar (FGC) line circuit elements
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3. Microtechnology in the development of three-dimensional circuits
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5. Three-dimensional high-frequency distribution networks part 2: Packaging and integration
6. Optimization of MM-wave distribution networks using silicon-based CPW
7. Theoretical and experimental study of various types of compensated dielectric bridges for millimeter-wave coplanar applications
8. A multiline method of network analyzer calibration
9. Integrated-circuit antennas
10. Interconnect series impedance determination using a surface ribbon method