Investigation of flip-chip bonding for MEMS applications

Journal of Electronic Packaging

Volumn 126, Issue 1, 2004, Pages 48-51

  Salalha, W ^a   Zussman, E ^a   Bar Yoseph, P Z ^a  

^a TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

APPROXIMATION THEORY; COMPUTER SIMULATION; FINITE ELEMENT METHOD; GEOMETRY; MATHEMATICAL MODELS; MICROELECTROMECHANICAL DEVICES; SOLDERING;

BOND NUMBER; ELECTRON MICROGRAPHS; LIQUID COLUMNS; SOLDER VOLUME;

FLIP CHIP DEVICES;

EID: 8744316855     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1646427     Document Type: Article

References (16)

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