Parametric finite element method for predicting shapes of three-dimensional solder joints

Journal of Electronic Packaging, Transactions of the ASME

Volumn 118, Issue 3, 1996, Pages 142-147

  Nigro, N J ^a   Zhou, F J ^a   Heinrich, S M ^a   Elkouh, A F ^a   Fournelle, R A ^a   Lee, P S ^b  

^a Marquette University   (United States)

^b Allen Bradley Company   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; DROP FORMATION; FINITE ELEMENT METHOD; INTERPOLATION; SOLDERING ALLOYS; SPATIAL VARIABLES CONTROL; SURFACE TENSION; SURFACES; THREE DIMENSIONAL;

AXISYMMETRIC JOINTS; ELEMENT NODAL COORDINATES; POTENTIAL ENERGY FUNCTION; SESSILE DROPS;

SOLDERED JOINTS;

EID: 0030230311     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792144     Document Type: Article

References (23)

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