Analysis of thermally enhanced SOIC packages

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 19, Issue 4, 1996, Pages 458-467

  Guenin, Bruce M ^a,b   Chowdhury, Asif R ^b   Groover, Richard L ^b   Derian, Edward J ^c  

^a IEEE

^b Amkor Electronics Inc   (United States)

^c Derian Consulting   (United States)

Author keywords

COL package; Dual sided package: SOIC; Finite element analysis; fused lead; Heat slug; Integrated circuit packaging; Molding compound; Thermal performance

Indexed keywords

BOUNDARY CONDITIONS; FINITE ELEMENT METHOD; HEAT CONVECTION; HEAT RESISTANCE; INTEGRATED CIRCUIT MANUFACTURE; LEAD; MICROELECTRONICS; SHEET MOLDING COMPOUNDS; THERMAL EFFECTS;

CHIP ON LEAD (COL) PACKAGES; DUAL SIDED INTEGRATED CIRCUIT PACKAGE; SMALL OUTLINE INTEGRATED CIRCUIT (SOIC);

INTEGRATED CIRCUITS;

EID: 0030380324     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.554925     Document Type: Article

References (13)

1. M. Tanaka and Y. Takeuchi, "Thermal analysis of plastic QFP with high thermal dissipation," in Proc. 42nd ECTC Symp., San Diego, 1992, pp. 332-339.
2. B. M. Guenin, R. C. Marrs, and R. J. Molnar, "Analysis of a thermally enhanced ball grid array package," IEEE Trans. Comp., Packag., Manufact. Technol., vol. 18, no. 4, pp. 749-757, 1995.
3. G. N. Ellison, Thermal Compulations for Electronic Equipment. Malabar, FL: Krieger Publishing, 1989, Ch. 2.
4. J. Andrews, "Package thermal resistance model: Dependency on equipment design," IEEE Comp., Hybrids, Manufact. Technol., vol. 11, no. 4, pp. 528-537, 1988.
5. "Integrated circuits thermal test method environmental conditions - Natural convection (still air)," Electronic Industries Association/JEDEC, Standard EIA/JESD51-2.
6. D. Edwards, "Development of JEDEC standard thermal measurement test boards," in Proc. SEMI-THERM XII Conf., Mar. 1996, pp. 183-190.
7. B. S. Lall, B. M. Guenin, R. C. Marrs, and R. J. Molnar, "Parametric FEA thermal model for QFP packages," in Proc. SEMI-THERM XII Conf., Mar. 1996, pp. 105-110.
8. A. Chowdhury, B. Guenin, R. Groover, and E. Derian, "Thermally-enhanced SOIC packages for power IC devices," in Proc. 8th Int. Symp. Power Semiconductor Devices and ICs, Maui, HI, May 20-23, 1996, pp. 313-316.
9. C. J. M. Lasance, H. Vinke, and H. Rosten, "Thermal characterization of electronic devices with boundary condition independent compact models," IEEE Trans. Comp., Packag., Manufact. Technol., vol. 18, no. 4, pp. 723-731, 1995.
10. S. W. Churchill, "A comprehensive correlating equation for laminar, assisting, forced, and free convection," AICHE J., vol. 23, pp. 10-17, 1977.
11. H. Shaukatullah, M. A. Gaynes, and L. H. White, "A nondimensional correlation for the external thermal characteristics of surface mount metal quad flat packs," in Proc. 4th Intersociety Conf. Thermal Phenomena Electron. Syst., 1994, pp. 237-244.
12. B. M. Guenin and D. Mahulikar, "Methodology for the thermal characterization of the MQUAD® microelectronic package," in Proc. SEMI-THERM IX Conf., Feb. 1993, pp. 176-185.
13. B. M. Guenin, "Transient thermal model for the MQUAD® microelectronic package," in Proc. SEMI-THERM X Conf., Feb. 1994, pp. 86-95.