Thermally enhanced plastic package with indented leadframe

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 338-342

  Lee, Chin C ^a   Chien, David H ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; ELECTRIC WIRE; FINITE ELEMENT METHOD; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS; SOLDERING; STAMPING;

SMALL OUTLINE INTEGRATED CIRCUIT (SOIC) PACKAGE;

ELECTRONICS PACKAGING;

EID: 0030678359     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)