Thermal-ADI: A linear-time chip-level dynamic thermal simulation algorithm based on alternating-direction-implicit (ADI) method

Proceedings of the International Symposium on Physical Design

Volumn , Issue , 2001, Pages 238-243

  Wang, T Y ^a   Chen, C C P ^a  

^a University of Wisconsin Madison   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; BOUNDARY CONDITIONS; COMPUTER SIMULATION; PARTIAL DIFFERENTIAL EQUATIONS; PERMITTIVITY; THERMAL CONDUCTIVITY; THERMAL EFFECTS;

ALTERNATING-DIRECTION-IMPLICIT (ADI) METHOD;

VLSI CIRCUITS;

EID: 0034826160     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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7. Full chip thermal simulation
8. The numerical solution of parabolic and elliptic differential equations
9. A general formulation of alternating direction methods- Part I. Parabolic and hyperbolic problems
10. Analytical methods in conduction heat transfer