A fuzzy method for global quality index evaluation of solder joints in surface mount technology

IEEE Transactions on Industrial Informatics

Volumn 7, Issue 1, 2011, Pages 115-124

  Acciani, Giuseppe ^a   Fornarelli, Girolamo ^a   Giaquinto, Antonio ^a  

^a POLITECNICO DI BARI   (Italy)

Author keywords

Fuzzy system; printed circuit boards (PCB); solder printing soldering assessment; surface mount technology (SMT)

Indexed keywords

FEATURE EXTRACTION; FUZZY SYSTEMS; PRINTING; SOLDERING; SURFACE MOUNT TECHNOLOGY;

COMPUTATIONAL COSTS; ELECTRONIC PACKAGE; HUMAN ASSESSMENT; INTERCONNECTION TECHNOLOGY; NEUROFUZZY SYSTEM; PRINTED CIRCUIT BOARDS (PCB); PROPOSED ARCHITECTURES; SOLDERING PASTES;

PRINTED CIRCUIT BOARDS;

EID: 85027927017     PISSN: 15513203     EISSN: None     Source Type: Journal    
DOI: 10.1109/TII.2010.2076292     Document Type: Article

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