Self-assembled three dimensional network designs for soft electronics

Nature Communications

Volumn 8, Issue , 2017, Pages

  Jang, Kyung In ^a,b   Li, Kan ^c   Chung, Ha Uk ^a,c   Xu, Sheng ^d   Jung, Han Na ^a   Yang, Yiyuan ^a   Kwak, Jean Won ^a   Jung, Han Hee ^b   Song, Juwon ^b   Yang, Ce ^e   Wang, Ao ^c,e   Liu, Zhuangjian ^f   Lee, Jong Yoon ^a,b   Kim, Bong Hoon ^a   Kim, Jae Hwan ^a   Lee, Jungyup ^a   Yu, Yongjoon ^a   Kim, Bum Jun ^a   Jang, Hokyung ^a   Yu, Ki Jun ^g   Kim, Jeonghyun ^h   Lee, Jung Woo ⁱ   Jeong, Jae Woong ^j   Song, Young Min ^k   Huang, Yonggang ^c   Zhang, Yihui ^e   Rogers, John A ^l   more..

^a University of Illinois at Urbana Champaign   (United States)

^b Daegu Gyeongbuk Institute of Science and Technology   (South Korea)

^c Northwestern University   (United States)

^d UNIVERSITY OF CALIFORNIA   (United States)

^e TSINGHUA UNIVERSITY   (China)

^f INSTITUTE OF HIGH PERFORMANCE COMPUTING   (Singapore)

^g Yonsei University   (South Korea)

^h Kwangwoon University   (South Korea)

ⁱ Pusan National University   (South Korea)

^j UCB 450   (United States)

^k Gwangju Institute of Science and Technology (GIST)   (South Korea)

^l NORTHWESTERN UNIVERSITY   (United States)

more..

Author keywords

[No Author keywords available]

Indexed keywords

ENCAPSULATION; EXPERIMENTAL DESIGN; MECHANICS; NETWORK ANALYSIS; OPTIMIZATION; PERFORMANCE ASSESSMENT; SENSOR;

ARTICLE; BIOCOMPATIBILITY; BIOMEDICAL ENGINEERING; CONTROLLED STUDY; ELECTRIC ACTIVITY; ELECTROCARDIOGRAPHY; ELECTRONIC SENSOR; ENCAPSULATION; FINITE ELEMENT ANALYSIS; GEOMETRY; MECHANICS; MEDICAL ELECTRONICS; MICROTECHNOLOGY; PROCESS OPTIMIZATION; SKIN; THREE DIMENSIONAL IMAGING; VIRTUAL REALITY; YOUNG MODULUS;

EID: 85021117393     PISSN: None     EISSN: 20411723     Source Type: Journal    
DOI: 10.1038/ncomms15894     Document Type: Article

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