Failure mechanics of organic-inorganic multilayer permeation barriers in flexible electronics

Composites Science and Technology

Volumn 71, Issue 3, 2011, Pages 365-372

  Jia, Zheng ^a   Tucker, Matthew B ^a   Li, Teng ^a,b  

^a UNIVERSITY OF MARYLAND   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

A. Flexible composites; A. Layered structures; B. Delamination; B. Fracture; Permeation barriers

Indexed keywords

A. LAYERED STRUCTURES; B. DELAMINATION; B. FRACTURE; FLEXIBLE COMPOSITES; PERMEATION BARRIERS;

ADHESION; DELAMINATION; FLEXIBLE ELECTRONICS; MULTILAYERS; PROTECTIVE COATINGS; STEEL SHEET; STRUCTURAL DESIGN; STRUCTURAL OPTIMIZATION;

FRACTURE;

EID: 78751637544     PISSN: 02663538     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compscitech.2010.12.003     Document Type: Article

References (34)

1. Forrest S. The path to ubiquitous and low-cost organic electronic appliances on plastic. Nature 2004, 428:911-918.
2. Reuss R.H., et al. Macroelectronics: perspectives on technology and applications. Proc IEEE 2005, 93:1239-1256.
3. Nathan A., Chalamala B.R. Flexible electronics technology, part II: materials and devices. Proc IEEE 2005, 93:1391-1393.
4. Crawford G.P. Flexible flat panel displays 2005, John Wiley&Sons, Chichester; Hoboken (NJ).
5. Rogers J.A., Someya T., Huang Y.G. Materials and mechanics for stretchable electronics. Science 2010, 327:1603-1607.
6. McElvain J., Antoniadis H., Hueschen M.R., Miller J.N., Roitman D.M., Sheats J.R., et al. Formation and growth of black spots in organic light-emitting diodes. J Appl Phys 1996, 80:6002-6007.
7. Sutherland D.G.J., et al. Photo-oxidation of electroluminescent polymers studied by core-level photoabsorption spectroscopy. Appl Phys Lett 1996, 68:2046-2048.
8. Liew Y.F., Aziz H., Hu N.X., Chan H.S.O., Xu G., Popovic Z. Investigation of the sites of dark spots in organic light-emitting devices. Appl Phys Lett 2000, 77:2650-2652.
9. Papadimitrakopoulos F., Zhang X.M., Higginson K.A. Chemical and morphological stability of aluminum tris(8-hydroxyquinoline) (Alq(3)): effects in light-emitting devices. IEEE J Selected Topics Quant Electron 1998, 4:49-57.
10. Schaer M., Nuesch F., Berner D., Leo W., Zuppiroli L. Water vapor and oxygen degradation mechanisms in organic light emitting diodes. Adv Funct Mater 2001, 11:116-121.
11. Nisato G., Kuilder M., Bouten P., Moro P., Philips L.O., Rutherford N. Thin film encapsulation for OLEDs: evaluation of multilayer barriers using the Ca test. SID Int Symp Digest Tech Papers 2003, 550-553.
12. Moro L, Krajewski TA, Rutherford N, Philips O, Visser RJ, Gross M, et al. Integrated encapsulation of bottom and top emission OLED displays. SPIE-The Int. Soc. Optic. Eng., Organic Light-Emitting Materials and Devices VIII; 2004.
13. Lewis J.S., Weaver M.S. Thin-film permeation-barrier technology for flexible organic light-emitting devices. Selected Topics Quant Electron IEEE J 2004, 10:45-57.
14. Cordero N., Yoon J., Suo Z.G. Channel cracks in a hermetic coating consisting of organic and inorganic layers. Appl Phys Lett 2007, 90:111910.
15. Chwang A.B., Rothman M.A., Mao S.Y., Hewitt R.H., Weaver M.S., Silvernail J.A., et al. Thin film encapsulated flexible organic electroluminescent displays. Appl Phys Lett 2003, 83:413-415.
16. Erlat AGn, Yan M, R. Duggal A. Substrates and thin-film barrier technology for flexible electronics; 2009. p. 413-49.
17. Burrows P.E., Graff G.L., Gross M.E., Martin P.M., Hall M., Mast E., et al. Gas permeation and lifetime tests on polymer-based barrier coatings. Proc SPIE 2001, 75.
18. Weaver M.S., Michalski L.A., Rajan K., Rothman M.A., Silvernail J.A., Brown J.J., et al. Organic light-emitting devices with extended operating lifetimes on plastic substrates. Appl Phys Lett 2002, 81:2929-2931.
19. Kim T.W., Yan M., Erlat G., McConnelee P.A., Pellow M., Deluca J., et al. Transparent hybrid inorganic/organic barrier coatings for plastic organic light-emitting diode substrates. J Vac Sci Techol A 2005, 23:971-977.
20. Graff G.L., Williford R.E., Burrows P.E. Mechanisms of vapor permeation through multilayer barrier films: lag time versus equilibrium permeation. J Appl Phys 2004, 96:1840-1849.
21. Beuth J.L. Cracking of thin bonded films in residual tension. Int J Solids Struct 1992, 29:1657-1675.
22. Hutchinson J.W., Suo Z. Mixed-mode cracking in layered materials. Adv Appl Mech 1992, 29:63-191.
23. Huang R., Prevost J.H., Huang Z.Y., Suo Z. Channel-cracking of thin films with the extended finite element method. Eng Fract Mech 2003, 70:2513-2526.
24. Vlassak J.J. Channel cracking in thin films on substrates of finite thickness. Int J Fract 2003, 119:299-323.
25. Tsui T.Y., McKerrow A.J., Vlassak J.J. Constraint effects on thin film channel cracking behavior. J Mater Res 2005, 20:2266-2273.
26. Ma Q. A four-point bending technique for studying subcritical crack growth in thin films and at interfaces. J Mater Res 1997, 12:840-845.
27. Ho S., Suo Z. Tunneling cracks in constrained layers. J Appl Mech - Trans ASME 1993, 60:890-894.
28. Liu X.H., Lane M.W., Shaw T.M., Simonyi E. Delamination in patterned films. Int J Solids Struct 2007, 44:1706-1718.
29. Cotterell B., Chen Z. Buckling and cracking of thin films on compliant substrates under compression. Int J Fract 2000, 104:169-179.
30. Ambrico J.M., Begley M.R. The role of initial flaw size, elastic compliance and plasticity in channel cracking of thin films. Thin Solid Films 2002, 419:144-153.
31. Mei H.X., Pang Y.Y., Huang R. Influence of interfacial delamination on channel cracking of elastic thin films. Int J Fract 2007, 148:331-342.
32. Li T., Suo Z. Ductility of thin metal films on polymer substrates modulated by interfacial adhesion. Int J Solids Struct 2007, 44:1696-1705.
33. Lu N.S., Wang X., Suo Z.G., Vlassak J. Metal films on polymer substrates stretched beyond 50%. Appl Phys Lett 2007, 91:221909.
34. Lu N.S., Wang X., Suo Z., Vlassak J. Failure by simultaneous grain growth, strain localization, and interface debonding in metal films on polymer substrates. J Mater Res 2009, 24:379-385.