Heat Dissipation Enhancement of 2.5D Package with 3D Graphene and 3D Boron Nitride Networks as Thermal Interface Material (TIM)

Proceedings - Electronic Components and Technology Conference

Volumn 2016-August, Issue , 2016, Pages 707-713

  Loeblein, Manuela ^a,b,c   Tsang, Siu Hon ^d   Han, Yong ^c   Zhang, Xiaowu ^c   Teo, Edwin Hang Tong ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b RESEARCH TECHNO PLAZA   (Singapore)

^c INSTITUTE OF MICROELECTRONICS   (Singapore)

^d NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Foam like material; Heat dissipation; Thermal interface material

Indexed keywords

BORON NITRIDE; CARBON; ELECTRIC CONDUCTANCE; ELECTRONIC EQUIPMENT; FOAMS; HEAT LOSSES; HEAT SINKS; INTERFACES (MATERIALS); NETWORK COMPONENTS; NITRIDES; THERMAL CONDUCTIVITY;

COMPUTATIONAL POWER; EXPONENTIAL INCREASE; FUTURE GENERATIONS; HARSH ENVIRONMENT; HEXAGONAL BORON NITRIDE; NANO-STRUCTURED; TEMPERATURE INCREASE; THERMAL INTERFACE MATERIALS;

THERMAL INSULATING MATERIALS;

EID: 84987784859     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2016.85     Document Type: Conference Paper

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