메뉴 건너뛰기




Volumn , Issue , 2013, Pages 627-632

A review of thermal management in power converters with thermal vias

Author keywords

[No Author keywords available]

Indexed keywords

DESIGN AND ANALYSIS; LITERATURE REVIEWS; POWER COMPONENTS; POWER ELECTRONICS CONVERTERS; PRINTED CIRCUIT BOARDS (PCB); SMALL-DIAMETER HOLES; THERMAL IMAGING CAMERAS; THERMAL PERFORMANCE;

EID: 84879334807     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/APEC.2013.6520276     Document Type: Conference Paper
Times cited : (28)

References (15)
  • 1
    • 0031628846 scopus 로고    scopus 로고
    • Optimization of thermal via design parameters based on an analytical thermal resistance model
    • Li R., Optimization of Thermal Via Design Parameters Based on an Analytical Thermal Resistance Model, Thermal and Thermomechanical Phenomena in Electronic Systems, 1998, pp. 475-480.
    • (1998) Thermal and Thermomechanical Phenomena in Electronic Systems , pp. 475-480
    • Li, R.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.