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Volumn 10, Issue 15, 2014, Pages 2992-2999

Configurable three-dimensional boron nitride-carbon architecture and its tunable electronic behavior with stable thermal performances

Author keywords

3D materials; BNC; electrical tuning; EMI shielding; thermal conductivity

Indexed keywords

ELECTRONICS PACKAGING; INTERFACES (MATERIALS); SHIELDING; THERMAL INSULATING MATERIALS;

EID: 84905566499     PISSN: 16136810     EISSN: 16136829     Source Type: Journal    
DOI: 10.1002/smll.201400292     Document Type: Article
Times cited : (55)

References (62)
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    • Kbox, A.1    Haskins, J.B.2    Sevik, C.3
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    • Collaboration, Vol. IEEE Std 299-1997, Inst. Electr. & Electron. Eng., New York, NY, USA, USA 1998, v+39.
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.