Low-temperature sintered silver attachment for high-temperature operation of SiC power devices

2006 4th International Conference on Integrated Power Systems, CIPS 2006

Volumn , Issue , 2006, Pages

  Bai, John G ^a   Zhang, Zach Z ^a   Lu, Ouo Quan ^a   Yin, Jian ^a   Van Wyk, J D ^a   Zhu, Lin ^b   Chow, T Paul ^b  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

^b RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIES; GOLD; GOLD COATINGS; HIGH TEMPERATURE OPERATIONS; SCHOTTKY BARRIER DIODES; SILICON CARBIDE; SILVER; SINTERING; SUBSTRATES; TEMPERATURE;

HIGH-TEMPERATURE ELECTRONICS; HIGH-TEMPERATURE POWER; LOW TEMPERATURE SINTERED; LOW-TEMPERATURE SINTERING; NANO-SILVER PASTES; ORGANIC COMPONENTS; SIC SCHOTTKY DIODE; SILVER NANOPARTICLES;

POWER SEMICONDUCTOR DEVICES;

EID: 84971426718     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)

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