An innovative approach to predict technology evolution for the desoldering of printed circuit boards: A perspective from China and America

Waste Management and Research

Volumn 34, Issue 6, 2016, Pages 491-501

  Wang, Chen ^a   Zhao, Wu ^a   Wang, Jie ^a   Chen, Ling ^b   Luo, Chun Jing ^a  

^a SICHUAN UNIVERSITY   (China)

^b LUND UNIVERSITY   (Sweden)

Author keywords

desoldering; ideal final result; technology life cycle; TRIZ; Waste printed circuit board

Indexed keywords

ELECTRONIC EQUIPMENT; ELECTRONIC WASTE; MAPPING; NETWORK COMPONENTS; RECYCLING; TIMING CIRCUITS;

DESOLDERING; IDEAL FINAL RESULT; TECHNOLOGY LIFE CYCLE; TRIZ; WASTE PRINTED CIRCUIT BOARD;

PRINTED CIRCUIT BOARDS;

DEVELOPMENT STRATEGY; ELECTRONIC EQUIPMENT; INNOVATION; LIFE CYCLE ANALYSIS; PREDICTION; RECYCLING; TECHNOLOGICAL CHANGE; WASTE MANAGEMENT;

ARTICLE; CHINA; CONDUCTANCE; ELECTROMAGNETIC FIELD; ELECTRONICS; PRIORITY JOURNAL; PROBLEM SOLVING; RECYCLING; TECHNOLOGY; WASTE PRINTED CIRCUIT BOARD; WESTERN HEMISPHERE; ELECTRONIC WASTE; INVENTION; NORTH AMERICA; PATENT; PROCEDURES; THEORETICAL MODEL; TRENDS; WASTE DISPOSAL;

CHINA;

CHINA; ELECTRONIC WASTE; INVENTIONS; MODELS, THEORETICAL; NORTH AMERICA; PATENTS AS TOPIC; RECYCLING; REFUSE DISPOSAL;

EID: 84971223301     PISSN: 0734242X     EISSN: 10963669     Source Type: Journal    
DOI: 10.1177/0734242X16640330     Document Type: Article

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