Experiments on reuse-oriented disassembly of components from printed circuit boards

Jixie Gongcheng Xuebao/Journal of Mechanical Engineering

Volumn 46, Issue 1, 2010, Pages 134-139

  Yang, Jiping ^a,b   Xiang, Dong ^a   Cheng, Yang ^a   Gao, Peng ^a   Duan, Guanghong ^a   Feng, Jian ^b  

^a TSINGHUA UNIVERSITY   (China)

^b Logistic Engineering University ^*  (China)

Author keywords

Disassembly process; Resource recycling; Reuse; Waste printed circuit board

Indexed keywords

DISASSEMBLY PROCESS; IC CHIPS; NON-CONTACT; OPTIMAL LEVEL; WASTE PRINTED CIRCUIT BOARD;

ASSEMBLY; EXPERIMENTS; HEATING; PRINTED CIRCUIT MANUFACTURE; RECYCLING; REUSABILITY;

PRINTED CIRCUIT BOARDS;

EID: 77049102002     PISSN: 05776686     EISSN: None     Source Type: Journal    
DOI: 10.3901/JME.2010.01.134     Document Type: Article

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