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Volumn 31, Issue 12, 2011, Pages 2569-2576

Recycling of organic materials and solder from waste printed circuit boards by vacuum pyrolysis-centrifugation coupling technology

Author keywords

Organic materials; Recycling; Solder; Vacuum pyrolysis centrifugation coupling technology; Waste printed circuit boards

Indexed keywords

CHEMICAL FEEDSTOCKS; COUPLING TECHNOLOGY; ENVIRONMENTAL POLLUTIONS; FTIR ANALYSIS; INORGANIC MATERIALS; MASS BALANCE; ORGANIC MATERIALS; PYROLYSIS OIL; PYROLYSIS PROCESS; PYROLYSIS RESIDUE; ROTATING DRUMS; SOLDER; SUBSTITUTED PHENOL; TEMPERATURE RANGE; VACUUM CONDITION; WASTE PRINTED CIRCUIT BOARD; WASTE PRINTED CIRCUIT BOARDS;

EID: 81155162532     PISSN: 0956053X     EISSN: 18792456     Source Type: Journal    
DOI: 10.1016/j.wasman.2011.07.002     Document Type: Article
Times cited : (63)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.