Leaching kinetics of copper from waste printed circuit boards by electro-generated chlorine in HCl solution

Hydrometallurgy

Volumn 107, Issue 3-4, 2011, Pages 124-132

  Kim, Eun Young ^a   Kim, Min Seuk ^b   Lee, Jae Chun ^b   Jeong, Jinki ^b   Pandey, B D ^b,c  

^a PENNSYLVANIA STATE UNIVERSITY   (United States)

^b Korea Institute of Geosceince and Mineral Resources   (South Korea)

^c NATIONAL METALLURGICAL LABORATORY   (India)

Author keywords

Copper leaching; Electro generated chlorine; Kinetics; PCBs (Printed Circuit Boards)

Indexed keywords

COMBINED REACTOR; COPPER LEACHING; DISSOLUTION KINETICS; ELECTRO-GENERATED CHLORINE; HCL SOLUTION; HYDROCHLORIC ACID SOLUTION; LEACHING BEHAVIOR; LEACHING KINETICS; LEACHING MECHANISM; LEACHING RATES; LEACHING TIME; LOGARITHMIC LAW; METAL LEACHING; PCBS (PRINTED CIRCUIT BOARDS); SEM-EDS; SURFACE AREA; SURFACE LAYERS; TEMPERATURE RANGE; WASTE PRINTED CIRCUIT BOARD;

ACTIVATION ENERGY; CHLORINE; COPPER; COPPER COMPOUNDS; DISSOLUTION; ELECTRONIC EQUIPMENT MANUFACTURE; HYDROCHLORIC ACID; LEACHING; METALS; TIN;

PRINTED CIRCUIT BOARDS;

EID: 79953242687     PISSN: 0304386X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.hydromet.2011.02.009     Document Type: Article

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