Printed circuit board recycling: A state-of-the-art survey

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 27, Issue 1, 2004, Pages 33-42

  Li, Jianzhi ^a   Shrivastava, Puneet ^a   Gao, Zong ^a   Zhang, Hong Chao ^a  

^a Department of Electrical and Computer Engineering   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ENVIRONMENTAL IMPACT; LIFE CYCLE; PRINTED CIRCUIT DESIGN; PRINTED CIRCUIT MANUFACTURE; RECYCLING; SERVICE LIFE;

DEMANUFACTURING; ELECTRONIC PRODUCT DISASSEMBLY; END-OF-LIFE; PRINTED CIRCUIT BOARDS RECYCLING;

PRINTED CIRCUIT BOARDS;

EID: 4544301219     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2004.830501     Document Type: Article

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