SCOPUS 정보 검색 플랫폼

Nanoscale

Volumn 7, Issue 14, 2015, Pages 6286-6294

Tuning thermal contact conductance at graphene-copper interface via surface nanoengineering

(4) Hong, Yang a Li, Lei a Zeng, Xiao Cheng a Zhang, Jingchao b

a UNIVERSITY OF NEBRASKA LINCOLN (United States)

b UNIVERSITY OF NEBRASKA LINCOLN (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT RESISTANCE; COPPER; GRAPHENE; STRUCTURAL DESIGN; SUBSTRATES; THERMAL CONDUCTIVITY OF SOLIDS;

INTERATOMIC FORCES; INTERFACIAL THERMAL RESISTANCE; NANOSCALE CONTACTS; PHONON INTERACTIONS; THERMAL CONTACT CONDUCTANCE; THERMAL CONTACT RESISTANCE; THERMAL ENERGY COUPLING; THERMAL TRANSPORT;

INTERFACES (MATERIALS);

EID: 84961288226 PISSN: 20403364 EISSN: 20403372 Source Type: Journal
DOI: 10.1039/c5nr00564g Document Type: Article

Times cited : (92)

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