Reliability of solder joints under electrical stressing - Strain evolution of solder joints

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn 2002-January, Issue , 2002, Pages 946-952

  Ye, Hua ^a   Basaran, C ^a   Hopkins, D ^b   Cartwright, A ^a  

^a UNIVERSITY AT BUFFALO   (United States)

^b NONE

Author keywords

Capacitive sensors; Electric variables measurement; Electromigration; Electronics packaging; Integrated circuit packaging; Lead; Power electronics; Soldering; Strain measurement; Stress measurement

Indexed keywords

CAPACITIVE SENSORS; ELECTROMIGRATION; ELECTRONICS PACKAGING; INTERFEROMETRY; LEAD; POWER ELECTRONICS; SOLDERING; STRAIN MEASUREMENT; STRESS MEASUREMENT;

DAMAGE MECHANICS; INTEGRATED CIRCUIT PACKAGING; MOIRE INTERFEROMETRY; POWER ELECTRONIC PACKAGING; SOLDER INTERCONNECTS; SOLDER JOINTS; STATE OF THE ART; STRAIN EVOLUTION;

ELECTRIC VARIABLES MEASUREMENT;

EID: 84950133661     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2002.1012558     Document Type: Conference Paper

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