On-chip interconnects for next generation system-on-chips

Proceedings of the Annual IEEE International ASIC Conference and Exhibit

Volumn 2002-January, Issue , 2002, Pages 211-215

  Brinkmann, A ^a   Niemann, J C ^a   Hehemann, I ^a,b   Langen, D ^a   Porrmann, M ^a   Ruckert U ^a  

^a UNIVERSITY OF PADERBORN   (Germany)

^b FRAUNHOFER INSTITUTE FOR MICROELECTRONIC CIRCUITS AND SYSTEMS   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; DESIGN; DISTRIBUTED COMPUTER SYSTEMS; INTEGRATED CIRCUIT INTERCONNECTS; MICROFABRICATION; MICROPROCESSOR CHIPS; SYSTEM-ON-CHIP;

COMMUNICATION INFRASTRUCTURE; DESIGN COMPLEXITY; FABRICATION TECHNOLOGIES; NEXT GENERATION SYSTEMS; NUMBER OF COMPONENTS; ON-CHIP INTERCONNECTS; PARALLEL COMPUTER; RESOURCE REQUIREMENTS;

INTEGRATED CIRCUIT DESIGN;

EID: 84949448972     PISSN: 10630988     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ASIC.2002.1158058     Document Type: Conference Paper

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