Thin film metallization by supersonic spraying of copper and nickel nanoparticles on a silicon substrate

Computational Materials Science

Volumn 108, Issue PA, 2015, Pages 114-120

  Lee, Jong Gun ^a   Kim, Do Yeon ^a   Kang, Byungjun ^a   Kim, Donghwan ^a   Al Deyab, Salem S ^b   James, Scott C ^c   Yoon, Sam S ^a  

^a Korea University   (South Korea)

^b KING SAUD UNIVERSITY   (Saudi Arabia)

^c BAYLOR UNIVERSITY   (United States)

Author keywords

Copper nickel electrode; Multi particle; Particle impact; Supersonic spray deposition

Indexed keywords

COPPER; DEPOSITION; ELECTRODES; FIGHTER AIRCRAFT; FILM GROWTH; FLAME SPRAYING; INTERFACES (MATERIALS); NANOPARTICLES; NICKEL; SILICON; SILICON SOLAR CELLS; SILICON WAFERS; SINTERING;

COMPUTATIONAL RESULTS; COPPER NICKELS; CRYSTALLINE SILICON SOLAR CELLS; NICKEL NANOPARTICLES; PARTICLE IMPACT; PARTICLE SIMULATIONS; SUPERSONIC SPRAY; THIN FILM METALLIZATION;

THIN FILMS;

EID: 84947925067     PISSN: 09270256     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.commatsci.2015.06.016     Document Type: Article

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