Microstructures and key properties of cold-sprayed and thermally sprayed copper coatings

Surface and Coatings Technology

Volumn 200, Issue 16-17, 2006, Pages 4947-4960

  Stoltenhoff, T ^a   Borchers, C ^a   Gärtner, Frank ^a   Kreye, H ^a  

^a HELMUT SCHMIDT UNIVERSITY   (Germany)

Author keywords

Bond strength; Cold spraying; Conductivity; Hardness; Microstructure; Thermal spraying

Indexed keywords

ANNEALING; BOND STRENGTH (MATERIALS); COPPER; DEFECTS; ELECTRIC CONDUCTIVITY; HARDNESS; MICROSTRUCTURE; RECRYSTALLIZATION (METALLURGY); SPRAYING;

COLD SPRAYING; COPPER COATINGS; THERMAL SPRAYING;

SPRAYED COATINGS;

ANNEALING; BOND STRENGTH (MATERIALS); COPPER; DEFECTS; ELECTRIC CONDUCTIVITY; HARDNESS; MICROSTRUCTURE; RECRYSTALLIZATION (METALLURGY); SPRAYED COATINGS; SPRAYING;

EID: 33644970272     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2005.05.011     Document Type: Article

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