Deposition behavior of thermally softened copper particles in cold spraying

Acta Materialia

Volumn 61, Issue 14, 2013, Pages 5105-5118

  Yin, Shuo ^a,b   Wang, Xiaofang ^a   Suo, Xinkun ^b   Liao, Hanlin ^b   Guo, Zhiwei ^b   Li, Wenya ^c   Coddet, Christian ^b  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

^b UNIVERSITÉ DE TECHNOLOGIE DE BELFORT MONTBÉLIARD   (France)

^c NORTHWESTERN POLYTECHNICAL UNIVERSITY   (China)

Author keywords

Cold spraying (CS); Deposition behavior; Numerical simulation; Particle preheating; Thermal softening

Indexed keywords

ABAQUS; COATINGS; COMPUTER SIMULATION; DEPOSITION; FIGHTER AIRCRAFT; FINITE ELEMENT METHOD; PREHEATING; STRAIN HARDENING; TEMPERATURE;

COLD SPRAYING; DEFORMATION FEATURE; DEPOSITION BEHAVIOR; HIGH TEMPERATURE CONDITION; INITIAL TEMPERATURES; INTERFACIAL REGION; PREHEATING TEMPERATURE; THERMAL SOFTENING;

THERMAL SPRAYING;

EID: 84882451225     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2013.04.041     Document Type: Article

References (38)

1. Alkhimov AP, Kosareve VF, Papyrin AN. Doklady Akademii Nauk SSSR 1990;315:1062.
2. Papyrin A. Adv Mater Process 2001;159:49.
3. Assadi H. Acta Mater 2003;51:4379.
4. Grujicic M, Zhao CL, DeRosset WS, Helfritch D. Mater Des 2004;25:681.
5. Schmidt T, Gärtner F, Assadi H, Kreye H. Acta Mater 2006;54:729.
6. Dykhuizen RC, Smith MF, Gilmore DL, Neiser RA, Jiang X, Sampath S. J Therm Spray Technol 1999;8:599.
7. Grujicic M, Saylor JR, Beasley DE, DeRosset WS, Helfritch D. Appl Surf Sci 2003;219:211.
8. Barradas S, Molins R, Jeandin M, Arrigoni M, Boustie M, Bolis C, et al. Surf Coat Technol 2005;197:18.
9. Klinkov SV, Kosarev VF, Rein M. Aerosp Sci Technol 2005;9:582.
10. Price TS, Shipway PH, McCartney DG, Calla E, Zhang D. J Therm Spray Technol 2007;16:566.
11. Bae G, Xiong Y, Kumar S, Kang K, Lee C. Acta Mater 2008;56:4858.
12. Bae G, Kumar S, Yoon S, Kang K, Na H, Kim H-J, et al. Acta Mater 2009;57:5654.
13. Hussain T, McCartney DG, Shipway PH, Zhang D. J Therm Spray Technol 2009;18:364.
14. Guetta S, Berger MH, Borit F, Guipont V, Jeandin M, Boustie M, et al. J Therm Spray Technol 2009;18:331.
15. Yin S, Wang X-f, Li W-y, Xu B-p. J Therm Spray Technol 2009;18:686.
16. Champagne VK, Helfritch D, Leyman P, Grendahl S, Klotz B. J Therm Spray Technol 2005;14:330.
17. Wank A, Wielage B, Podlesak H, Grund T. J Therm Spray Technol 2006;15:280.
18. Calvo FA, Urena A, Desalazar JMG, Molleda F. J Mater Sci 1988;23:2273.
19. Manna I, Majumdar JD. J Mater Sci Lett 1993;12:920.
20. Funamizu Y, Watanabe K. Trans Jpn Inst Met 1977;12:147.
21. Lee H, Shin H, Ko K. J Therm Spray Technol 2009;19:102.
22. Bolesta AV, Fomin VM, Sharafutdinov MR, Tolochko BP. Nucl Instrum Methods Phys Res, Sect A 2001;470:249.
23. Barradas S, Guipont V, Molins R, Jeandin M, Arrigoni M, Boustie M, et al. J Therm Spray Technol 2007;16:548.
24. King PC, Bae G, Zahiri SH, Jahedi M, Lee C. J Therm Spray Technol 2009;19:620.
25. Wang H-T, Li C-J, Yang G-J, Li C-X. Appl Surf Sci 2008;255:2538.
26. Wang H-T, Li C-J, Ji G-C, Yang G-J. J Therm Spray Technol 2012.
27. Ning X-J, Jang J-H, Kim H-J. Appl Surf Sci 2007;253:7449.
28. Shin S, Yoon S, Kim Y, Lee C. Surf Coat Technol 2006;201:3457.
29. Kim K, Watanabe M, Kawakita J, Kuroda S. Scr Mater 2008;59:768.
30. Kim K, Watanabe M, Kuroda S. Scr Mater 2009;60:710.
31. Kim K, Watanabe M, Kuroda S. Surf Coat Technol 2010;204:2175.
32. Li W-Y, Li C-J, Liao H. Appl Surf Sci 2010;256:4953.
33. ABAQUS 6.11-2 user manual. Pawtucket: Hibbitt, Karlsson and Soerensen; 2011.
34. Yin S, Wang X-F, Li W-Y, Xu B-P. J Therm Spray Technol 2010;19:1155.
35. Johnson GR, Cook WH. A constitutive model and data for metals subjected to large strains, high strain rates and high temperatures. In: 7th Int symp on ballistics, The Netherlands; 1983. p. 541.
36. Xu Y, Zhang J, Bai Y, Meyers MA. Metall Mater Trans A 2008;39:811.
37. William FS, editor. Foundations of materials science and engineering. New York: McGraw-Hill; 1993.
38. Fukumoto M, Wada H, Tanabe K, Yamada M, Yamaguchi E, Niwa A, et al. J Therm Spray Technol 2007;16:643.