Nickel-copper hybrid electrodes self-adhered onto a silicon wafer by supersonic cold-spray

Acta Materialia

Volumn 93, Issue , 2015, Pages 156-163

  Lee, Jong Gun ^a   Kim, Do Yeon ^a   Kang, Byungjun ^a   Kim, Donghwan ^a   Song, Hee Eun ^b   Kim, Jooyoung ^c   Jung, Woonsuk ^c   Lee, Dukhaeng ^c   Al Deyab, Salem S ^d   James, Scott C ^e   Yoon, Sam S ^a  

^a Korea University   (South Korea)

^b Korea Institute of Energy Research (KIER)   (South Korea)

^c Hojin Platech Inc   (South Korea)

^d KING SAUD UNIVERSITY   (Saudi Arabia)

^e Baylor University   (United States)

Author keywords

Contact resistivity; Nickel copper electrode; Silicon solar cell; Specific resistivity; Supersonic cold spraying

Indexed keywords

COPPER; ELECTRON MICROSCOPY; ENERGY DISPERSIVE SPECTROSCOPY; FABRICATION; FLAME SPRAYING; NICKEL; SCANNING ELECTRON MICROSCOPY; SILICON SOLAR CELLS; SILICON WAFERS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION;

COLD SPRAYING; CONTACT RESISTIVITIES; COPPER ELECTRODES; FABRICATION METHOD; HYBRID ELECTRODES; LIGHT-INDUCED PLATINGS; SPECIFIC RESISTIVITIES; SUPERSONIC SPRAYING;

ELECTRODES;

EID: 84929327674     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2015.04.012     Document Type: Article

References (35)

1. J. Wang, and B. Tian Mercury-free disposable lead sensors based on potentiometric stripping analysis of gold-coated screen-printed electrodes Anal. Chem. 65 1993 1529 1532
2. C. Ballif, D. Huljić, G. Willeke, and A. Hessler-Wyser Silver thick-film contacts on highly doped n-type silicon emitters: structural and electronic properties of the interface Appl. Phys. Lett. 82 2003 1878 1880
3. M. Ju, Y.-J. Lee, J. Lee, B. Kim, K. Ryu, K. Choi, K. Song, K. Lee, C. Han, and Y. Jo Double screen printed metallization of crystalline silicon solar cells as low as 30μm metal line width for mass production Sol. Energy Mater. Sol. Cells 100 2012 204 208
4. M.M. Hilali, A. Rohatgi, B. To. A review and understanding of screen-printed contacts and selective-emitter formation, in: 14th workshop on crystalline silicon solar cells and modules, vol. 1617, 2004, pp. 80401-83393.
5. T. Nitta, T. Ohmi, T. Hoshi, S. Sakai, K. Sakaibara, S. Imai, and T. Shibata Evaluating the large electromigration resistance of copper interconnects employing a newly developed accelerated life-test method J. Electrochem. Soc. 140 1993 1131 1137
6. J. Lloyd, J. Clemens, and R. Snede Copper metallization reliability MiRe 39 1999 1595 1602
7. L. Tous, J.F. Lerat, T. Emeraud, R. Negru, K. Huet, A. Uruena, M. Aleman, J. Meersschaut, H. Bender, and R. Russell Nickel silicide contacts formed by excimer laser annealing for high efficiency solar cells Prog. Photovoltaics Res. Appl. 21 2013 267 275
8. D.K. Schroder, and D.L. Meier Solar cell contact resistance-a review Electron Devices 31 1984 637 647 IEEE
9. A. Nguyen, M. Rane-Fondacaro, H. Efstathiadis, P. Haldar, L. Michaelson, C. Wang, K. Munoz, T. Tyson, A. Gallegos. Formation of a low ohmic contact nickel silicide layer on textured silicon wafers using electroless nickel plating, in: Proc. of the 25th EPVSEC, 2010, pp. 2672-2675.
10. A. Mondon, J. Bartsch, B. Godejohann, M. Hörteis, S. Glunz. Advanced front side metallization for crystalline silicon solar cells based on a nickel-silicon contact, in: 2nd Workshop on Metallization of Crystalline Silicon Solar Cells, 2010.
11. C.N. Dheasuna, A. Mathewson, L. Hecking, and G. Wrixon Novel buried contact technology for advanced silicon solar cells Photovoltaic Energy Convers. 2 1994 1496 1499 IEEE
12. A. Mondon, M. Jawaid, J. Bartsch, M. Glatthaar, and S. Glunz Microstructure analysis of the interface situation and adhesion of thermally formed nickel silicide for plated nickel-copper contacts on silicon solar cells Sol. Energy Mater. Sol. Cells 117 2013 209 213
13. A. Ebong, I.B. Cooper, B.C. Rounsaville, A. Rohatgi, M. Dovrat, E. Kritchman, D. Brusilovsky, and A. Benichou Capitalizing on the glass-etching effect of silver plating chemistry to contact Si solar cells with homogeneous 100-110 emitters IEEE Electron Device Lett. 32 2011 779 781
14. J. Hyung Lee, Y. Hyun Lee, J. Yong Ahn, and J.-W. Jeong Analysis of series resistance of crystalline silicon solar cell with two-layer front metallization based on light-induced plating Sol. Energy Mater. Sol. Cells 95 2011 22 25
15. A. Focsa, D. Blanc, G. Poulain, C. Barbos, M. Gauthier, N. Le Quang, and M. Lemiti Copper light-induced plating contacts with Ni seed-layer for mc-Si solar cells after laser ablation of SiNx: H Energy Procedia 38 2013 713 719
16. A. Mette, C. Schetter, D. Wissen, S. Lust, S. Glunz, and G. Willeke Increasing the efficiency of screen-printed silicon solar cells by light-induced silver plating Photovoltaic Energy Conv. 1 2006 1056 1059 IEEE
17. A. Sharma, M. Suresh, H. Bhojraj, H. Narayanamurthy, and R. Sahu Electroless nickel plating on magnesium alloy Met. Finish. 96 1998 10 16
18. C. Borchers, F. Gärtner, T. Stoltenhoff, H. Assadi, and H. Kreye Microstructural and macroscopic properties of cold sprayed copper coatings J. Appl. Phys. 93 2003 10064 10070
19. T. Stoltenhoff, C. Borchers, F. Gärtner, and H. Kreye Microstructures and key properties of cold-sprayed and thermally sprayed copper coatings Surf. Coat. Technol. 200 2006 4947 4960
20. J. Liu, X. Zhou, X. Zheng, H. Cui, and J. Zhang Tribological behavior of cold-sprayed nanocrystalline and conventional copper coatings Appl. Surf. Sci. 258 2012 7490 7496
21. C. Hager Jr., J. Sanders, S. Sharma, A. Voevodin, and A. Segall The effect of temperature on gross slip fretting wear of cold-sprayed nickel coatings on Ti6Al4V interfaces Tribol. Int. 42 2009 491 502
22. Y. Zou, W. Qin, E. Irissou, J.-G. Legoux, S. Yue, and J.A. Szpunar Dynamic recrystallization in the particle/particle interfacial region of cold-sprayed nickel coating: electron backscatter diffraction characterization Scr. Mater. 61 2009 899 902
23. D.-Y. Kim, J.-J. Park, J.-G. Lee, D. Kim, S.J. Tark, S. Ahn, J.H. Yun, J. Gwak, K.H. Yoon, and S. Chandra Cold spray deposition of copper electrodes on silicon and glass substrates J. Therm. Spray Technol. 22 2013 1092 1102
24. D. Gilmore, R. Dykhuizen, R. Neiser, M. Smith, and T. Roemer Particle velocity and deposition efficiency in the cold spray process J. Therm. Spray Technol. 8 1999 576 582
25. T. Schmidt, F. Gärtner, H. Assadi, and H. Kreye Development of a generalized parameter window for cold spray deposition Acta Mater. 54 2006 729 742
26. C.-J. Li, W.-Y. Li, and Y.-Y. Wang Formation of metastable phases in cold-sprayed soft metallic deposit Surf. Coat. Technol. 198 2005 469 473
27. T. Van Steenkiste, J. Smith, and R. Teets Aluminum coatings via kinetic spray with relatively large powder particles Surf. Coat. Technol. 154 2002 237 252
28. L.A. Giannuzzi, and F.A. Stevie A review of focused ion beam milling techniques for TEM specimen preparation Micron 30 2005 197 204
29. K. Das, and S.K. De Optical and photoconductivity studies of Cu2O nanowires synthesized by solvothermal method J. Lumin. 129 2009 1015 1022
30. H. Usui, N. Uchida, and H. Sakaguchi Influence of order in stepwise electroless deposition on anode properties of thick-film electrodes consisting of Si particles coated with Ni and Cu J. Power Sources 196 2011 10244 10248
31. H. Zhu, G. John, and B. Wei Synthesis of assembled copper nanoparticles from copper-chelating glycolipid nanotubes Chem. Phys. Lett. 405 2005 49 52
32. D.-H. Kang, H. Zhang, H. Yoo, H.H. Lee, S. Lee, G.W. Lee, H. Lou, X. Wang, Q. Cao, and D. Zhang Interfacial free energy controlling glass-forming ability of Cu-Zr alloys Sci. Rep. 4 2014 05167
33. H. Hai, J. Ahn, D. Kim, J. Lee, H. Chung, and C. Kim Developing process for coating copper particles with silver by electroless plating method Surf. Coat. Technol. 201 2006 3788 3792
34. Y. Hu, and S.P. Tay Spectroscopic ellipsometry investigation of nickel silicide formation by rapid thermal process J. Vac. Sci. Technol. A 16 1998 1820 1824
35. D.K. Schroder Semiconductor Material and Device Characterization 2006 John Wiley & Sons