Cooling hot spots by hexagonal boron nitride heat spreaders

Proceedings - Electronic Components and Technology Conference

Volumn 2015-July, Issue , 2015, Pages 1658-1663

  Sun, Shuangxi ^a   Bao, Jie ^b   Mu, Wei ^a,b   Fu, Yifeng ^c   Zhang, Yong ^a,b   Ye, Lilei ^c   Liu, Johan ^a,b  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^b SHANGHAI UNIVERSITY   (China)

^c SHT SMART HIGH TECH AB   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT FLUX; HEATING EQUIPMENT; III-V SEMICONDUCTORS; NETWORK COMPONENTS; SPREADERS;

DIFFERENT LAYERS; ELECTRONIC SYSTEMS; HEAT SPREADING EFFECT; HEXAGONAL BORON NITRIDE; HIGH POWER CHIPS; HIGHER EFFICIENCY; THERMAL DISSIPATION; THERMAL PERFORMANCE;

THERMAL MANAGEMENT (ELECTRONICS);

EID: 84942122300     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2015.7159819     Document Type: Conference Paper

References (24)

1. ITRS, "International Technology Roadmap for Semiconductors 2007 Edition-Assembly and Packaging," 2007.
2. F. Schwierz, "Graphene transistors," Nat. Nanotechnol. , vol. 5, no. 7, pp. 487-496, Jul. 2010.
3. R. Mahajan, C. Chiu, and G. Chrysler, "Cooling a Microprocessor Chip," Proc. IEEE, vol. 94, no. 8, pp. 1476-1486, Aug. 2006.
4. R. Prasher, "Thermal Interface Materials: Historical Perspective, Status, and Future Directions," Proc. IEEE, vol. 94, no. 8, pp. 1571-1586, Aug. 2006.
5. S. Sun, W. Mu, Y. Zhang, B. Carlberg, L. Ye, and J. Liu, "Dissipating heat from hot spot using a new nano thermal interface material," in 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012, pp. 171-176.
6. Microelectronic Failure Analysis: Desk Reference : 2002 Supplement. ASM International, 2002.
7. Prem, Nath, "Thermal conductivity of copper films," Thin Solid Films, vol. 20, no. 1, pp. 53-62, Jan. 1974.
8. Z. Gao, Y. Zhang, Y. Fu, M. M. F. Yuen, and J. Liu, "Thermal chemical vapor deposition grown graphene heat spreader for thermal management of hot spots," Carbon, vol. 61, pp. 342-348, Sep. 2013.
9. Y. Zhang, P. Zhang, N. Wang, Y. Fu, and J. Liu, "Use of graphene-based films for hot spot cooling," in Electronics System-Integration Technology Conference (ESTC), 2014, 2014, pp. 1-4.
10. Y. Fu, N. Nabiollahi, T. Wang, S. Wang, Z. Hu, B. Carlberg, Y. Zhang, X. Wang, and J. Liu, "A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity," Nanotechnology, vol. 23, no. 4, p. 045304, Feb. 2012.
11. T. Sugino and T. Tai, "Dielectric Constant of Boron Nitride Films Synthesized by Plasma-Assisted Chemical Vapor Deposition," Jpn. J. Appl. Phys. , vol. 39, no. 11A, p. L1101, Nov. 2000.
12. R. Haubner, M. Wilhelm, R. Weissenbacher, and B. Lux, "Boron Nitrides-Properties, Synthesis and Applications," in High Performance Non-Oxide Ceramics II, P. D. M. Jansen, Ed. Springer Berlin Heidelberg, 2002, pp. 1-45.
13. Y. Kubota, K. Watanabe, O. Tsuda, and T. Taniguchi, "Deep Ultraviolet Light-Emitting Hexagonal Boron Nitride Synthesized at Atmospheric Pressure," Science, vol. 317, no. 5840, pp. 932-934, Aug. 2007.
14. K. Watanabe, T. Taniguchi, T. Niiyama, K. Miya, and M. Taniguchi, "Far-ultraviolet plane-emission handheld device based on hexagonal boron nitride," Nat. Photonics, vol. 3, no. 10, pp. 591-594, Oct. 2009.
15. K. Watanabe, T. Taniguchi, and H. Kanda, "Directbandgap properties and evidence for ultraviolet lasing of hexagonal boron nitride single crystal," Nat. Mater. , vol. 3, no. 6, pp. 404-409, Jun. 2004.
16. C. R. Dean, A. F. Young, I. Meric, C. Lee, L. Wang, S. Sorgenfrei, K. Watanabe, T. Taniguchi, P. Kim, K. L. Shepard, and J. Hone, "Boron nitride substrates for highquality graphene electronics," Nat. Nanotechnol. , vol. 5, no. 10, pp. 722-726, Oct. 2010.
17. T. Ouyang, Y. Chen, Y. Xie, K. Yang, Z. Bao, and J. Zhong, "Thermal transport in hexagonal boron nitride nanoribbons," Nanotechnology, vol. 21, no. 24, p. 245701, Jun. 2010.
18. G. Gao, W. Gao, E. Cannuccia, J. Taha-Tijerina, L. Balicas, A. Mathkar, T. N. Narayanan, Z. Liu, B. K. Gupta, J. Peng, Y. Yin, A. Rubio, and P. M. Ajayan, "Artificially Stacked Atomic Layers: Toward New van der Waals Solids," Nano Lett. , vol. 12, no. 7, pp. 3518-3525, Jul. 2012.
19. L. Song, L. Ci, H. Lu, P. B. Sorokin, C. Jin, J. Ni, A. G. Kvashnin, D. G. Kvashnin, J. Lou, B. I. Yakobson, and P. M. Ajayan, "Large Scale Growth and Characterization of Atomic Hexagonal Boron Nitride Layers," Nano Lett. , vol. 10, no. 8, pp. 3209-3215, Aug. 2010.
20. A. Kulachenko, T. Denoyelle, S. Galland, and S. B. Lindström, "Elastic properties of cellulose nanopaper," Cellulose, vol. 19, no. 3, pp. 793-807, Mar. 2012.
21. R. V. Gorbachev, I. Riaz, R. R. Nair, R. Jalil, L. Britnell, B. D. Belle, E. W. Hill, K. S. Novoselov, K. Watanabe, T. Taniguchi, A. K. Geim, and P. Blake, "Hunting for Monolayer Boron Nitride: Optical and Raman Signatures," Small, vol. 7, no. 4, pp. 465-468, Feb. 2011.
22. S. Hu, M. Lozada-Hidalgo, F. C. Wang, A. Mishchenko, F. Schedin, R. R. Nair, E. W. Hill, D. W. Boukhvalov, M. I. Katsnelson, R. a. W. Dryfe, I. V. Grigorieva, H. A. Wu, and A. K. Geim, "Proton transport through oneatom-thick crystals," Nature, vol. 516, no. 7530, pp. 227-230, Dec. 2014.
23. K. K. Kim, A. Reina, Y. Shi, H. Park, L.-J. Li, Y. H. Lee, and J. Kong, "Enhancing the conductivity of transparent graphene films via doping," Nanotechnology, vol. 21, no. 28, p. 285205, Jul. 2010.
24. A. Bar-Cohen, A. A. Watwe, and R. S. Prasher, "Heat transfer in electronic equipment," Heat Transf. Handb. , vol. 13, pp. 947-1027, 2003.