Low temperature Cu-Cu bonding using Ag nanostructure for 3D integration

ECS Solid State Letters

Volumn 4, Issue 10, 2015, Pages P75-P76

  Liu, Ziyu ^a   Cai, Jian ^a,b   Wang, Qian ^a   Tan, Lin ^a   Hu, Yang ^a  

^a TSINGHUA UNIVERSITY   (China)

^b TSINGHUA NATIONAL LABORATORY FOR INFORMATION SCIENCE AND TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

INTERFACES (MATERIALS); NANOSTRUCTURES; PULSED LASER DEPOSITION; TEMPERATURE; THREE DIMENSIONAL INTEGRATED CIRCUITS;

3-D INTEGRATION; ANNEALING PROCESS; BONDING INTERFACES; BONDING PROCESS; CU-CU BONDINGS; ELECTRICAL RESISTANCES; LOW TEMPERATURES; VOID-FREE;

SILVER;

EID: 84940035560     PISSN: 21628742     EISSN: 21628750     Source Type: Journal    
DOI: 10.1149/2.0061510ssl     Document Type: Article

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