Nanoporous gold bumps for low temperature bonding

Microelectronics Reliability

Volumn 52, Issue 2, 2012, Pages 356-360

  Oppermann, Hermann ^a   Dietrich, Lothar ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING CONDITIONS; CELLULAR STRUCTURE; FLIP CHIP BONDING; LOW TEMPERATURE BONDING; LOW TEMPERATURES; MESOSCALE; NANOPOROUS GOLD; REDUCED STIFFNESS;

BONDING; GOLD; GOLD ALLOYS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; SILVER ALLOYS;

GOLD COATINGS;

EID: 84855900454     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2011.06.027     Document Type: Article

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