Vibration durability comparison of Sn37Pb vs SnAgCu solders

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Volumn , Issue , 2006, Pages

  Yuxun, Zhou ^a   Scanff, Estelle ^a   Dasgupta, Abhijit ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONDITION MONITORING; FAILURE (MECHANICAL); LARGE SCALE SYSTEMS; MATHEMATICAL MODELS; REAL TIME SYSTEMS; SOLDERING ALLOYS; SURFACE MOUNT TECHNOLOGY; VIBRATION CONTROL;

FATIGUE DURABILITY; REAL-TIME FAILURE MONITORING; SURFACE MOUNT TECHNOLOGY (SMT) INTERCONNECTS; VIBRATION DURABILITY;

TIN COMPOUNDS;

EID: 85196482653     PISSN: 10716947     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2006-13555     Document Type: Conference Paper

References (17)

1. K. Upadhyayula, and A. Dasgupta, "Guidelines for Physics-of-Failure Based Accelerated Stress Test", Reliability and Maintainability Symposium, pp 345-357, 1998
2. Q. Zhang, A. Dasgupta, and P. Haswell, "Isothermal Mechanical Durability of Three Selected Pb-Free Solders: Sn3.9Ag0.6Cu, Sn3.5Ag and Sn0.7Cu", Transctions of the ASME, vol. 127, pp 512-522, 2005
3. A. Woodrow, "JCAA/JG-PP No-Lead Solder Project: Vibration Test", Boeing Electronics Materials and Processes Report, 2005
4. A. Woodrow, "JCAA/JG-PP No-Lead Solder Project: Vibration Test", Presented at IPC APEX, Anaheim, CA, Feb 5-10, 2006
5. N. Dowling, "Mechanical Behavior of Material: Engineering Methods for Deformation, Fracture, and Fatigue" Prentice-Hall, 1999
6. J. Lau, K. Gratalo, and E. Schneider, "Solder Joint Reliability of Large Plastic Ball Grid Aray Assemblies under Bending, Twisting, and Vibration Conditions", Circuit World, Vol. 22, pp. 27-32, 1995
7. K. Darbha, S. Ling, and A. Dasgupta, "Stress Analysis of Surface-Mount Interconnections Due to Vibration Loading", Journal of Electronic Packaging, Vol. 119, pp. 183-188, 1997
8. D. B. Barker, A. Dasgupta and M. G. Pecht, "PWB solder joint life calculation under thermal and vibration loading", Proceedings Annual Reliability and Maintainability Symposium, pp. 451-459, 1991
9. D. B. Barker, Y. S. Chen, and A. Dasgupta, "Estimating the vibration fatigue life of quad leaded surface mount components", Journal of Electronics packaging, vol. 115, pp. 195-200, 1993
10. S. Liguore, S. Fields, D. Followell, and R. Perez, "Vibration fatigue of leadless chip carrier solder joints", ASMe paper 92-WA/EEP-25, 1992
11. J. Lau et al., "Solder joint reliability of surface mount connectors", Journal of Electronic Packaging, Vol. 115, pp. 180-188, 1993
12. J. Lau, "Solder joint reliability of flip chip and plastic ball grid array assemblies under thermal, mechanical and vibration conditions", IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol, 19, pp. 728-735, 1996
13. J. Lau, E. Schneider, and T. Baker, "Shock and vibration of solder bumped flip chip on organic coated copper boards", Journal of Electronics Packaging, Vol. 118, pp. 101-104, 1996
14. Q. J. Yang, Z. P. Wang, G. H. Lim, John H. L. Pang, F. F. Yap and R. M. Lin, "Reliability of PBGA Assemblies Under Out-of Plane Vibration Excitation", IEEE Transactions on Components and Packaging Technologies, Vol. 25, pp. 293-300, 2002
15. F. X. Che, H. L. J. Pang, F. L. Wong, G. H. Lim and T. H. Low, "Vibration Fatigue Test and Analysis for Flip Chip Solder Joints", Electronics Packaging Technology Conference, pp. 107-113, 2003
16. R. Darveaux and K. Banerji "Constitutive Relations for Tin-Based Solder Joint", IEEE Transactions on Components, Hybrid and Manufacturing Technology, vol. 15, No. 6, pp 1013-1023, 1992
17. K. Upadhyayula, "An Incremental Damage Superposition Approach for Surface Mount Electronic Interconnect Durability under Combined Temperature and Vibration Environments", PHD Thesis, University of Maryland, 1999