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Volumn , Issue , 1998, Pages 246-250
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Vibrational fatigue of surface mount solder joints
a
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Author keywords
[No Author keywords available]
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Indexed keywords
CRACK PROPAGATION;
ELECTRONICS PACKAGING;
FATIGUE OF MATERIALS;
FINITE ELEMENT METHOD;
FRACTURE MECHANICS;
INTERFACES (MATERIALS);
MATHEMATICAL MODELS;
PRINTED CIRCUIT BOARDS;
STIFFNESS;
SURFACE MOUNT TECHNOLOGY;
THREE DIMENSIONAL;
VIBRATIONS (MECHANICAL);
POWER SPECTRUM DENSITY;
QUAD FLAT PACK;
SURFACE MOUNT SOLDER INTERCONNECT;
SOLDERED JOINTS;
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EID: 0031625742
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (16)
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References (13)
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