Reliability of carbon nanotube bumps for chip on glass application

ESTC 2014 - 5th Electronics System-Integration Technology Conference

Volumn , Issue , 2014, Pages

  Fan, Xiaogang ^a   Li, Xiaolei ^a   Mu, Wei ^a,b   Jiang, Di ^b   Huang, Shirong ^a   Fu, Yifeng ^c   Zhang, Yan ^a   Liu, Johan ^a,b  

^a SHANGHAI UNIVERSITY   (China)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^c SHT SMART HIGH TECH AB   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE JOINTS; ADHESIVES; CONTACT RESISTANCE; GLASS; GLASS BONDING; HEAT RESISTANCE; INTEGRATED CIRCUIT INTERCONNECTS; RELIABILITY; SUBSTRATES; THERMAL CYCLING;

ANISOTROPIC CONDUCTIVE ADHESIVES; CANDIDATE MATERIALS; DIFFERENT STRUCTURE; ELECTRICAL AND MECHANICAL PROPERTIES; ELECTRICAL FAILURES; ELECTRONIC INTERCONNECTS; FOUR-POINT PROBE METHOD; GLASS SUBSTRATES;

CARBON NANOTUBES;

EID: 84918566023     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2014.6962753     Document Type: Conference Paper

References (15)

1. Iijima S., "Helical Microtubules of Graphitic Carbon", Nature, Vol. 354(1991), pp. 56-58.
2. Ruoff, R. S., and D. C. Lorents, 1995, Carbon 33, 925.
3. M. S. Dresselhaus, G. Dresselhaus, and P. C. Eklund, Science of Fullerenes and Carbon Nanotubes (Academic, San Diego, 1996).
4. I.Kang, Y. Y. Heung, J.H. Kim, J.W. Lee, R. Gollapudi, S. Subramaniam S. Narasimhadevara, D. Hurd, G. R. Kirikera, V. Shanov, M. J. Schulz, D.L. Shi, J. Boerio, S, Mall, M. Ruggles-Wren, "Introduction to Carbon Nanotube and Nanofiber Smart Materials", Composites: Part B, xx (2006), pp. 1-13.
5. Iwai T., Shioya H., Kondo D., Hirose S., Kawabata A., Sato S., Nihei M., Kikkawa T., Joshin K., Awano Y., and Yokoyama N., "Thermal and Source Bumps utilizing Carbon Nanotubes for Flip-chip High Power Amplifiers", IEEE IEDM Tech. Digest, Dec. 2005, pp. 257-260.
6. T. Wang, M. Jönsson, E.E.B. Campbell, J. Liu, "Development of Carbon Nanotube Bumps for Ultra Fine Pitch Flip Chip Interconnection", 2006 Electronics System Integration Technology Conference, Dresden, Germany.
7. A.A. Puretzky, D.B. Geohegan, S. Jesse, I.N. Ivanov, G. Eres, "In situ measurements and modeling of carbon nanotube array growth kinetics during chemical vapor deposition", Applied Physics A. 81 (2005) 223-240.
8. D.N. Futaba, K. Hata, T. Namai, T. Yamada, K. Mizuno, Y. Hayamizu, et al., "84% Catalyst Activity of Water-Assisted Growth of Single Walled Carbon Nanotube Forest Characterization by a Statistical and Macroscopic Approach", The Journal of Physical Chemistry B. 110 (2006) 8035-8038.
9. T. Wang, K. Jeppson, J. Liu, "Dry densification of carbon nanotube bundles", Carbon. 48 (2010) 3795-3801.
10. M. D. Volder, S. H. Tawfi ck, S. J. Park, D. Copic, Z.Z. Zhao, W. Lu, A J. Hart, "Diverse 3D Microarchitectures Made by Capillary Forming of Carbon Nanotubes", Advanced Materials. 22 (2010) 4384-4389.
11. D. Jiang, T. Wang, Si Chen, L.L. Ye, J. Liu, "Paper-mediated controlled densification and low temperature transfer of carbon nanotube forests for electronic interconnect application", Microelectronic Engineering. 103 (2013) 177-180.
12. T. Wang, B. Carlberg, M. Jönsson, G.-H. Jeong, E.E.B. Campbell, J. Liu, Low temperature transfer and formation of carbon nanotube arrays by imprinted conductive adhesive, Applied Physics Letters. 91 (2007) 093123.
13. Y.F. Fu, Yiheng Qin, Teng Wang, Si Chen, Johan Liu, "Ultrafast Transfer of Metal-Enhanced Carbon Nanotubes at Low Temperature for Large-Scale Electronics Assembly", Adv. Mater. 2010, 22, 5039-5042.
14. A. Sinha, J. A. Mihailovic, J. E. Morris, H. Lu, C. Bailey, "Modeling Thermal Conductivity and CTE for CNT-Cu Composites for 3-D TSV application", 2010 IEEE Nanotechnology Materials and Devices Conference, Oct 12-15, 2010, Monterey, California, USA.
15. D. Lu, C.P. Wong and Q.K. Tong. Mechanisms underlying the unstable joint resistance of conductive adhesives, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part C. 22(3), pp. 228-232(1999).