Thermal and source bumps utilizing carbon nanotubes for flip-chip high power amplifiers

Technical Digest - International Electron Devices Meeting, IEDM

Volumn 2005, Issue , 2005, Pages 257-260

  Iwai, T ^a   Shioya, H ^a   Kondo, D ^a   Hirose, S ^a   Kawabata, A ^a   Sato, S ^a   Nihei, M ^a   Kikkawa, T ^a   Joshin, K ^a   Awano, Y ^a   Yokoyama, N ^a  

^a FUJITSU LABORATORIES LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; POWER AMPLIFIERS; THERMAL CONDUCTIVITY; VOLTAGE CONTROL;

HIGH POWER AMPLIFIERS (HPA); SOURCE BUMPS; THERMAL BUMPS;

CARBON NANOTUBES;

EID: 33847710695     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

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2. M. Nihei, D. Kondo, A. Kawabata, S. Sato, H. Shioya, M. Sakaue, T. Iwai, M. Ohfuchi, and Y. Awano, "Low-resistance Multi-walled Carbon Nanotube Vias with Parallel Channel Conduction of Inner Shells," IEEE 2005 IITC Tech. Digest, pp. 234-236
3. F. Kreupl. A. P. Graham, M. Liebau, G. S. Duesberg, R. Seidel, and E. Unger, "Carbon Nanotubes for Interconnect Applications," IEEE IEDM Tech. Digest, pp. 683-686, 2004
4. P. Kim, L. Shi, A. Majumdar, and P. L. McEuen, "Thermal Transport Measurements of Individual Multiwalled Nanotubes," Phys. Rev. Lett. 87 215502 (2001).
5. M. Horibe, M. Nihei, D. Kondo, A. Kawabata, and Y. Awano, "Influence of Growth Mode of Carbon Nanotubes on Physical Properties for Multiwalled Carbon Nanotube Films Grown by Catalystic Chemical Vapor Deposition," Jpn. J. Appl. Phys. 43 (2004), pp. 7337-7341.
6. T. Kikkawa, T. Maniwa, H. Hayashi, M. Kanamura, S. Yokokawa, M. Nishi, N. Adachi, M. Yokoyama, Y. Tateno, and K. Joshin, "An Over 200-W Output Power GaN HEMT Push-Pull Amplifier with High Reliability," IEEE Int. Microwave Symp. Dig., pp. 1347-1350, 2004.