A solder joint structure with vertically aligned carbon nanofibres as reinforcements

ESTC 2014 - 5th Electronics System-Integration Technology Conference

Volumn , Issue , 2014, Pages

  Chen, Si ^a,b   Jiang, Di ^b   Ye, Lilei ^c   Liu, Johan ^a,b  

^a SHANGHAI UNIVERSITY   (China)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^c SHT SMART HIGH TECH AB   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON NANOFIBERS; COPPER ALLOYS; COPPER METALLOGRAPHY; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; GOLD ALLOYS; GOLD METALLOGRAPHY; REINFORCEMENT; SCANNING ELECTRON MICROSCOPY; SILICON ALLOYS; SILVER ALLOYS; SILVER METALLOGRAPHY; TERNARY ALLOYS; THERMAL FATIGUE; TIN ALLOYS; TIN METALLOGRAPHY;

ASSEMBLY PROCESS; CARBON NANOFIBRES; ELECTRONIC PACKAGING INDUSTRY; SN-3.0AG-0.5CU; SOLDER JOINTS; THERMAL CYCLING TEST; VERTICALLY ALIGNED;

SOLDERED JOINTS;

EID: 84918514617     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2014.6962851     Document Type: Conference Paper

References (10)

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