Formation and use of palladium(II)-thiol complexes at the surface of PDMS stamps for the fabrication of high resolution and high density metal patterns using soft-lithography techniques

Colloids and Surfaces A: Physicochemical and Engineering Aspects

Volumn 466, Issue , 2015, Pages 75-84

  Coulm, Jérémy ^a   Léonard, Didier ^a   Desroches, Cédric ^b   Bessueille, François ^a  

^a UNIVERSITÉ DE LYON   (France)

^b UNIVERSITÉ LYON 1   (France)

Author keywords

Electroless deposition; Metal patterns; Microcontact printing; Palladium nanoparticles; Palladium(II) thiol complexes; Submerged microcontact printing

Indexed keywords

DEPOSITION; ELECTROLESS PLATING; ELECTRON DEVICE MANUFACTURE; LITHOGRAPHY; METAL NANOPARTICLES; METALS; MICROCHANNELS; NANOTECHNOLOGY; PALLADIUM; PRINTING; SILICON WAFERS; WET ETCHING;

BOTTOM-UP PROCESS; HIGH-DENSITY METAL; METAL PATTERNS; MICRO CONTACT PRINTING; PALLADIUM NANOPARTICLES; REDUCING CONDITIONS; THIOL COMPLEXES; TOP-DOWN PROCESS;

PALLADIUM COMPOUNDS;

COPPER; DIMETICONE; GOLD; NANOPARTICLE; NICKEL; PALLADIUM COMPLEX; PALLADIUM(II) THIOL COMPLEX; UNCLASSIFIED DRUG;

ANALYTIC METHOD; ARTICLE; ATOMIC FORCE MICROSCOPY; CATALYST; COLLOID; COMPARATIVE STUDY; COMPLEX FORMATION; CONTROLLED STUDY; DIFFUSION; MICROSCOPY; NANOFABRICATION; SCANNING ELECTRON MICROSCOPY; SOFT LITHOGRAPHY TECHNIQUE; SURFACE PROPERTY; SYNTHESIS; TRANSMISSION ELECTRON MICROSCOPY;

EID: 84912140758     PISSN: 09277757     EISSN: 18734359     Source Type: Journal    
DOI: 10.1016/j.colsurfa.2014.10.057     Document Type: Article

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