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1
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77954213333
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Ultra-thin chip technology and applications, a new paradigm in silicon technology
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J. N. Burghartz, W. Appel, C. Harendt, H. Rempp, H. Richter, and M. Zimmermann, "Ultra-thin chip technology and applications, a new paradigm in silicon technology," Solid-State Electronics, vol. 54, pp. 818-829, 2010.
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Solid-State Electronics
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Burghartz, J.N.1
Appel, W.2
Harendt, C.3
Rempp, H.4
Richter, H.5
Zimmermann, M.6
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2
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84893250450
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High curvature bending characterization of ultra-thin chips and chip-on-foil assemblies
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ed New York: Ieee
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D. van den Ende, F. Verhoeven, P. van der Eijnden, R. Kusters, A. Sridhar, M. Cauwe, et al., "High curvature bending characterization of ultra-thin chips and chip-on-foil assemblies," in 2013 European Microelectronics Packaging Conference, ed New York: Ieee, 2013.
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(2013)
2013 European Microelectronics Packaging Conference
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Ende Den D.Van1
Verhoeven, F.2
Eijnden Der P.Van3
Kusters, R.4
Sridhar, A.5
Cauwe, M.6
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4
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50549104405
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Flipchip Bonding of Si Chip on Flexible PEN Foil using Novel Electronic 100 μm Pitch Fan-out Circuitry
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J. v. d. Brand, E. Veninga, R. Kusters, T. Podprocky, and A. Dietzel, "Flipchip Bonding of Si Chip on Flexible PEN Foil using Novel Electronic 100 μm Pitch Fan-out Circuitry," Matererial Research Society Symposium Proceedings, vol. 1030, pp. G05-10-17, 2008.
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Matererial Research Society Symposium Proceedings
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Brand, J.V.D.1
Veninga, E.2
Kusters, R.3
Podprocky, T.4
Dietzel, A.5
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5
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78651287374
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Flipchip bonding of ultrahin Si dies onto PEN/PET substrates with low cost circuitry
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Berlin
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J. v. d. Brand, R. Kusters, M. Heeren, B. v. Remoortere, and A. Dietzel, "Flipchip bonding of ultrahin Si dies onto PEN/PET substrates with low cost circuitry " presented at the ESTC 2010, Berlin, 2010.
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(2010)
The ESTC 2010
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Brand, J.V.D.1
Kusters, R.2
Heeren, M.3
Remoortere B, V.4
Dietzel, A.5
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6
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84902440718
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A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels
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M. Cauwe, B. Vandecasteele, J. De Baets, J. van den Brand, R. Kusters, A. Sridhar, et al., "A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels," 2012 4th Electronic System-Integration Technology Conference (Estc), p. 6, 2012.
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(2012)
2012 4th Electronic System-Integration Technology Conference (Estc)
, pp. 6
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Cauwe, M.1
Vandecasteele, B.2
De Baets, J.3
Van Brand Den, J.4
Kusters, R.5
Sridhar, A.6
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7
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84866853919
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Novel Interconnect Methodologies for Ultra-thin Chips on Foils
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IEEE
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A. Sridhar, M. Cauwe, H. Fledderus, R. H. L. Kusters, J. van den Brand, and Ieee, "Novel Interconnect Methodologies for Ultra-thin Chips on Foils," 2012 Ieee 62nd Electronic Components and Technology Conference (Ectc), pp. 238-244, 2012.
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(2012)
2012 Ieee 62nd Electronic Components and Technology Conference (Ectc)
, pp. 238-244
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Sridhar, A.1
Cauwe, M.2
Fledderus, H.3
Kusters, R.H.L.4
Van Den Brand, J.5
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8
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84873474632
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Stretchable electronics technology for large area applications: Fabrication and mechanical characterization
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Feb
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F. Bossuyt, T. Vervust, and J. Vanfleteren, "Stretchable Electronics Technology for Large Area Applications: Fabrication and Mechanical Characterization," Ieee Transactions on Components Packaging and Manufacturing Technology, vol. 3, pp. 229-235, Feb 2013.
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(2013)
Ieee Transactions on Components Packaging and Manufacturing Technology
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Bossuyt, F.1
Vervust, T.2
Vanfleteren, J.3
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9
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77950214388
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Materials and mechanics for stretchable electronics
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Mar 26
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J. A. Rogers, T. Someya, and Y. Huang, "Materials and mechanics for stretchable electronics," Science, vol. 327, pp. 1603-7, Mar 26 2010.
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(2010)
Science
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Rogers, J.A.1
Someya, T.2
Huang, Y.3
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