-
1
-
-
79955037663
-
Low-temperature fabrication of high-performance metal oxide thin-film electronics via combustion processing
-
Kim, M.-G., Kanatzidis, M. G., Facchetti, A. &Marks, T. J. Low-temperature fabrication of high-performance metal oxide thin-film electronics via combustion processing. Nat. Mater. 10, 382-388 (2011)
-
(2011)
Nat. Mater
, vol.10
, pp. 382-388
-
-
Kim, M.-G.1
Kanatzidis, M.G.2
Facchetti, A.3
Marks, T.J.4
-
2
-
-
77953467709
-
Fabricating nanowire devices on diverse substrates by simple transfer-printing methods
-
Lee, C. H., Kim, D. R. &Zheng, X. L. Fabricating nanowire devices on diverse substrates by simple transfer-printing methods. Proc. Nati. Acad. Sci. USA. 107, 9950-9955 (2010)
-
(2011)
Proc. Nati. Acad. Sci. USA
, vol.107
, pp. 9950-9955
-
-
Lee, C.H.1
Kim, D.R.2
Zheng, X.L.3
-
3
-
-
84867030009
-
Transfer printing techniques for materials Assembly andMicro/Nanodevice Fabrication
-
Carlson, A., Bowen, A. M., Huang, Y., Nuzzo, R. G. &Rogers, J. A. Transfer Printing Techniques for Materials Assembly andMicro/Nanodevice Fabrication. Adv. Mater. 24, 5284-5318 (2012)
-
(2012)
Adv. Mater
, vol.24
, pp. 5284-5318
-
-
Carlson, A.1
Bowen, A.M.2
Huang, Y.3
Nuzzo, R.G.4
Rogers, J.A.5
-
4
-
-
78049300014
-
Microstructured elastomeric surfaces with reversible adhesion and examples of their use in deterministic assembly by transfer printing
-
Kim, S. et al. Microstructured elastomeric surfaces with reversible adhesion and examples of their use in deterministic assembly by transfer printing. Proc. Nati. Acad. Sci. USA. 107, 17095-17100 (2010)
-
(2011)
Proc. Nati. Acad. Sci. USA
, vol.107
, pp. 17095-17100
-
-
Kim, S.1
-
5
-
-
30044447991
-
Transfer printing by kinetic control of adhesion to an elastomeric stamp
-
Meitl, M. A. et al. Transfer printing by kinetic control of adhesion to an elastomeric stamp. Nat. Mater. 5, 33-38 (2006)
-
(2006)
Nat. Mater
, vol.5
, pp. 33-38
-
-
Meitl, M.A.1
-
6
-
-
82255186762
-
Flexible, foldable, actively multiplexed, high-density electrode array for mapping brain activity in vivo
-
Viventi, J. et al. Flexible, foldable, actively multiplexed, high-density electrode array for mapping brain activity in vivo. Nat. Neurosci. 14, 1599-1605 (2011)
-
(2011)
Nat. Neurosci
, vol.14
, pp. 1599-1605
-
-
Viventi, J.1
-
7
-
-
77954581072
-
Dissolvable films of silk fibroin for ultrathin conformal biointegrated electronics
-
Kim, D.-H. et al. Dissolvable films of silk fibroin for ultrathin conformal biointegrated electronics. Nat. Mater. 9, 511-517 (2010)
-
(2011)
Nat. Mater
, vol.9
, pp. 511-517
-
-
Kim, D.-H.1
-
8
-
-
77952692175
-
GaAs photovoltaics and optoelectronics using releasable multilayer epitaxial assemblies
-
Yoon, J. S. et al. GaAs photovoltaics and optoelectronics using releasable multilayer epitaxial assemblies. Nature 465, 126-131 (2010)
-
(2011)
Nature
, vol.465
, pp. 126-131
-
-
Yoon, J.S.1
-
9
-
-
84866753558
-
A physically transient form of silicon electronics
-
Hwang, S.-W. et al. A Physically Transient Form of Silicon Electronics. Science 337, 1640-1644 (2012)
-
(2012)
Science
, vol.337
, pp. 1640-1644
-
-
Hwang, S.-W.1
-
10
-
-
79952307332
-
Arrays of silicon micro/nanostructures formed in Suspended Configurations for Deterministic Assembly Using Flat and Roller-Type Stamps
-
Yang, Y. et al. Arrays of Silicon Micro/Nanostructures Formed in Suspended Configurations for Deterministic Assembly Using Flat and Roller-Type Stamps. Small 7, 484-491 (2011)
-
(2011)
Small
, vol.7
, pp. 484-491
-
-
Yang, Y.1
-
11
-
-
80051629902
-
Fabrication of nanowire electronics on Nonconventional Substrates by Water-Assisted Transfer Printing Method
-
Lee, C. H., Kim, D. R. &Zheng, X. Fabrication of Nanowire Electronics on Nonconventional Substrates by Water-Assisted Transfer Printing Method. Nano Lett. 11, 3435-3439 (2011)
-
(2011)
Nano Lett
, vol.11
, pp. 3435-3439
-
-
Lee, C.H.1
Kim, D.R.2
Zheng, X.3
-
12
-
-
84871756125
-
Peel-And-stick: Fabricating thin film solar cell on Universal Substrates
-
Lee, C. H. et al. Peel-And-Stick: Fabricating Thin Film Solar Cell on Universal Substrates. Sci. Rep. 2, 1000 (2012)
-
(2012)
Sci. Rep
, vol.2
, pp. 1000
-
-
Lee, C.H.1
-
13
-
-
84877904336
-
Transfer of functional memory devices to any substrate
-
Choi, J. M., Kim, M. S., Seol, M. L. &Choi, Y. K. Transfer of functional memory devices to any substrate. Phys. Status Solidi RRL 5, 326-331 (2013)
-
(2013)
Phys. Status Solidi RRL
, vol.5
, pp. 326-331
-
-
Choi, J.M.1
Kim, M.S.2
Seol, M.L.3
Choi, Y.K.4
-
14
-
-
84872745647
-
Flexible and stretchable polymers with embedded Magnetic Nanostructures
-
Donolato, M., Tollan, C., Maria Porro, J., Berger, A. &Vavassori, P. Flexible and Stretchable Polymers with Embedded Magnetic Nanostructures. Adv. Mater. 25, 623-629 (2012)
-
(2012)
Adv. Mater
, vol.25
, pp. 623-629
-
-
Donolato, M.1
Tollan, C.2
Maria Porro, J.3
Berger, A.4
Vavassori, P.5
-
15
-
-
0035909763
-
ReaxFF: A reactive force field for hydrocarbons
-
Van Duin, A. C. T., Dasgupta, S., Lorant, F. &Goddard, W. A. ReaxFF: A reactive force field for hydrocarbons. J. Phys. Chem. A 105, 9396-9409 (2001)
-
(2001)
J. Phys. Chem
, vol.105
, pp. 9396-9409
-
-
Van Duin, A.C.T.1
Dasgupta, S.2
Lorant, F.3
Goddard, W.A.4
-
16
-
-
84858260705
-
Environmentally assisted debonding of copper/barrier interfaces
-
Birringer, R. P., Shaviv, R., Besser, P. R. &Dauskardt, R. H. Environmentally assisted debonding of copper/barrier interfaces. Acta Mater. 60, 2219-2228 (2012)
-
(2012)
Acta Mater
, vol.60
, pp. 2219-2228
-
-
Birringer, R.P.1
Shaviv, R.2
Besser, P.R.3
Dauskardt, R.H.4
-
17
-
-
84977695915
-
Influence of water vapor on crack propagation in Glass
-
Wiederhorn, S.M. Influence of Water Vapor on Crack Propagation in Glass. Am. Ceram. Soc. Bull. 50, 407-414 (1967)
-
(1967)
Am. Ceram. Soc. Bull
, vol.50
, pp. 407-414
-
-
Wiederhorn, S.M.1
-
18
-
-
34548645783
-
On the physics of moisture-induced cracking in metal-glass (copper-silica) interfaces
-
Card, J. C., Cannon, R.M., Saiz, E., Tomsia, A. P.&Ritchie, R. O. On the physics of moisture-induced cracking in metal-glass (copper-silica) interfaces. J. Appl. Phys. 102, 053516 (2007)
-
(2007)
J. Appl. Phys
, vol.102
, pp. 053516
-
-
Card, J.C.1
Cannon, R.M.2
Saiz, E.3
Tomsia, A.P.4
Ritchie, R.O.5
-
19
-
-
0346686074
-
Fracture of nanoporous thin-film glasses
-
Guyer, E. P. &Dauskardt, R. H. Fracture of nanoporous thin-film glasses. Nat. Mater. 3, 53-57 (2004)
-
(2004)
Nat. Mater
, vol.3
, pp. 53-57
-
-
Guyer, E.P.1
Dauskardt, R.H.2
-
20
-
-
0036470469
-
Moisture-Assisted subcritical debonding of a polymer/metal interface
-
Kook, S. Y. &Dauskardt, R. H. Moisture-Assisted subcritical debonding of a polymer/metal interface. J. Appl. Phys. 91, 1293-1303 (2002)
-
(2002)
J. Appl. Phys
, vol.91
, pp. 1293-1303
-
-
Kook, S.Y.1
Dauskardt, R.H.2
-
21
-
-
0019898001
-
A molecular interpretation of stress-corrosion in Silica
-
Michalske, T. A. &Freiman, S.W. A Molecular Interpretation of Stress-Corrosion in Silica. Nature 295, 511-512 (1982)
-
(1982)
Nature
, vol.295
, pp. 511-512
-
-
Michalske, T.A.1
Freiman, S.W.2
-
22
-
-
0001572676
-
Moisture assisted crack growth in ceramics
-
Wiederhorn, S. M. Moisture Assisted Crack Growth in Ceramics. Int. J. Fract. Mech. 4, 171-177 (1968)
-
(1968)
Int. J. Fract. Mech
, vol.4
, pp. 171-177
-
-
Wiederhorn, S.M.1
-
23
-
-
0036470469
-
Moisture-Assisted subcritical debonding of a polymer/metal interface
-
Kook, S. Y. &Dauskardt, R. H. Moisture-Assisted subcritical debonding of a polymer/metal interface. J. Appl.Phys. 91, 1293-1303 (2002)
-
(2002)
J. Appl.Phys
, vol.91
, pp. 1293-1303
-
-
Kook, S.Y.1
Dauskardt, R.H.2
-
24
-
-
84858251043
-
Direct measurement of adhesion energy of Monolayer Graphene As-Grown on Copper and Its Application to Renewable Transfer Process
-
Yoon, T. et al. Direct Measurement of Adhesion Energy of Monolayer Graphene As-Grown on Copper and Its Application to Renewable Transfer Process. Nano Lett. 12, 1448-1452 (2012)
-
(2012)
Nano Lett
, vol.12
, pp. 1448-1452
-
-
Yoon, T.1
-
25
-
-
77949815673
-
Development and validation of reaxff reactive Force Field for Hydrocarbon Chemistry Catalyzed by Nickel
-
Mueller, J. E., Van Duin, A. C. T. &Goddard, W. A., III. Development and Validation of ReaxFF Reactive Force Field for Hydrocarbon Chemistry Catalyzed by Nickel. J. Phys. Chem. C 114, 4939-4949 (2010)
-
(2011)
J. Phys. Chem
, vol.114
, pp. 4939-4949
-
-
Mueller, J.E.1
Van Duin, A.C.T.2
Goddard, W.A.3
-
26
-
-
77955201547
-
A reactive molecular dynamics simulation of the silica-water interface
-
Fogarty, J. C., Aktulga, H. M., Grama, A. Y., Van Duin, A. C. T. &Pandit, S. A. A reactive molecular dynamics simulation of the silica-water interface. J. Chem. Phys. 132 (2010)
-
(2011)
J. Chem. Phys
, vol.132
-
-
Fogarty, J.C.1
Aktulga, H.M.2
Grama, A.Y.3
Van Duin, A.C.T.4
Pandit, S.A.5
-
27
-
-
0032136099
-
The surface energy of metals
-
Vitos, L., Ruban, A. V., Skriver, H. L.&Kollar, J. The surface energy of metals. Surf. Sci. 411, 186-202 (1998)
-
(1998)
Surf. Sci
, vol.411
, pp. 186-202
-
-
Vitos, L.1
Ruban, A.V.2
Skriver, H.L.3
Kollar, J.4
-
28
-
-
62849100802
-
Effects of residual stresses on interfacial adhesion measurement
-
Nie, P., Shen, Y., Chen, Q. &Cai, X. Effects of residual stresses on interfacial adhesion measurement. Mech. Mater. 41, 545-552 (2009)
-
(2009)
Mech. Mater
, vol.41
, pp. 545-552
-
-
Nie, P.1
Shen, Y.2
Chen, Q.3
Cai, X.4
-
29
-
-
73849112041
-
Optimized structural designs for stretchable Silicon Integrated Circuits
-
Kim, D. H. et al. Optimized Structural Designs for Stretchable Silicon Integrated Circuits. Small 5, 2841-2847 (2009)
-
(2009)
Small
, vol.5
, pp. 2841-2847
-
-
Kim, D.H.1
-
30
-
-
84859078101
-
Imbricate scales as a design construct for Microsystem Technologies
-
Kim, S. et al. Imbricate Scales as a Design Construct for Microsystem Technologies. Small 8, 901-906 (2011)
-
(2011)
Small
, vol.8
, pp. 901-906
-
-
Kim, S.1
|