SCOPUS 정보 검색 플랫폼

Acta Materialia

Volumn 60, Issue 5, 2012, Pages 2219-2228

Environmentally assisted debonding of copper/barrier interfaces

(4) Birringer, Ryan P a Shaviv, Roey b Besser, Paul R c Dauskardt, Reinhold H a

a Stanford University (United States)

b NOVELLUS SYSTEMS INC (United States)

c IBM MICROELECTRONICS (United States)

Author keywords

Copper; Environmentally assisted cracking; Hydrogen; Nitride; Oxidation

Indexed keywords

BOND RUPTURE; CHEMICAL ACTIVITIES; CU-INTERCONNECTS; ENVIRONMENTALLY ASSISTED CRACKING; OXIDIZING ENVIRONMENTS; OXIDIZING SPECIES; REDUCING ENVIRONMENT; TIME-DEPENDENT DIELECTRIC BREAKDOWN;

ACTIVATION ENERGY; COPPER; HYDROGEN; NITRIDES; OXIDATION;

DEBONDING;

EID: 84858260705 PISSN: 13596454 EISSN: None Source Type: Journal
DOI: 10.1016/j.actamat.2012.01.007 Document Type: Article

Times cited : (30)

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