Elastomeric thermal interface materials with high through-plane thermal conductivity from carbon fiber fillers vertically aligned by electrostatic flocking

Advanced Materials

Volumn 26, Issue 33, 2014, Pages 5857-5862

  Uetani, Kojiro ^b   Ata, Seisuke ^a,b   Tomonoh, Shigeki ^a   Yamada, Takeo ^a,b   Yumura, Motoo ^a,b   Hata, Kenji ^a,b  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^b Technology Research Association for Single Wall Carbon Nanotubes TASC   (Japan)

Author keywords

electrostatic flocking; thermal interface materials; through plane thermal conductivity; vertically aligned carbon fibers

Indexed keywords

CARBON FIBERS; ELECTRONIC EQUIPMENT; FILLERS; INTERFACES (MATERIALS); NONWOVEN FABRICS; THERMAL INSULATING MATERIALS;

CARBON FIBER FILLER; ELASTOMERIC BEHAVIOR; ELECTROSTATIC FLOCKINGS; HIGH THERMAL CONDUCTIVITY; INTRINSIC PROPERTY; THERMAL INTERFACE MATERIALS; THROUGH-PLANE THERMAL CONDUCTIVITIES; VERTICALLY ALIGNED;

THERMAL CONDUCTIVITY;

EID: 84906948492     PISSN: 09359648     EISSN: 15214095     Source Type: Journal    
DOI: 10.1002/adma.201401736     Document Type: Article

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