Creating conductive copper-silver bimetallic nanostructured coatings using a high temperature reducing jet aerosol reactor

Aerosol Science and Technology

Volumn 47, Issue 8, 2013, Pages 858-866

  Sharma, Munish K ^a   Buchner, Raymond D ^a   Scharmach, William J ^b   Papavassiliou, Vasilis ^b   Swihart, Mark T ^a  

^a University at Buffalo ^*  (United States)

^b PRAXAIR INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANTIBACTERIAL COATINGS; CONVERGING-DIVERGING NOZZLES; ELECTRICAL CONDUCTIVITY; METAL SALT PRECURSORS; NANOPARTICLE FORMATION; NANOSTRUCTURED COATINGS; NANOSTRUCTURED COPPER; NANOSTRUCTURED THIN FILM;

AEROSOLS; COATINGS; DEPOSITION; ELECTRIC CONDUCTIVITY; METAL NANOPARTICLES; SILVER; SILVER PLATING; SINTERING; SUBSTRATES; THIN FILMS; VAPOR DEPOSITION;

COST REDUCTION;

COPPER; METAL NANOPARTICLE; NANOCOATING; SILVER;

AEROSOL; ARTICLE; ATOMIC FORCE MICROSCOPY; CATALYSIS; COMBUSTION; CRYSTALLIZATION; DECOMPOSITION; ELECTRIC CONDUCTIVITY; ELECTRON DIFFRACTION; ELECTRONICS; FILM; FLOW RATE; GAS FLOW; HEAT TRANSFER; HIGH TEMPERATURE; HIGH TEMPERATURE PROCEDURES; PARTICLE SIZE; POWER SUPPLY; PRIORITY JOURNAL; REACTOR; ROENTGEN SPECTROSCOPY; SCANNING ELECTRON MICROSCOPY; TRANSMISSION ELECTRON MICROSCOPY; VELOCITY;

EID: 84879093731     PISSN: 02786826     EISSN: 15217388     Source Type: Journal    
DOI: 10.1080/02786826.2013.796338     Document Type: Article

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