Effect of CuSO4 Content in the Plating Bath on the Properties of Composites from Electroless Plating of Ni-Cu-P on Birch Veneer

BioResources

Volumn 9, Issue 2, 2014, Pages 2949-2959

  Hui, Bin ^a   Li, Jian ^a   Zhao, Qi ^a   Liang, Tieqiang ^a   Wang, Lijuan ^a  

^a NORTHEAST FORESTRY UNIVERSITY   (China)

Author keywords

Birch veneer; CuSO4 content; Electroless Ni Cu P plating; Electromagnetic shielding effectiveness; Morphology; Wettability

Indexed keywords

CONTACT ANGLE; CRYSTALLINITY; ELECTROLESS PLATING; MAGNETIC SHIELDING; MORPHOLOGY; NICKEL COATINGS; NICKEL COMPOUNDS; PHASE STRUCTURE; SCANNING ELECTRON MICROSCOPY; SURFACE MORPHOLOGY; VENEERS; X RAY PHOTOELECTRON SPECTROSCOPY;

ELEMENTAL COMPOSITIONS; EMI SHIELDING EFFECTIVENESS; FINE GRAIN STRUCTURE; HYDROPHOBIC PROPERTIES; PROPERTIES OF COMPOSITES; SHIELDING EFFECTIVENESS; STATIC CONTACT ANGLE; WOOD-BASED COMPOSITES;

COPPER COMPOUNDS;

ANATOMY; CONTACT ANGLE; CRYSTALLINITY; ESCA; NICKEL COMPOUNDS; SCANNING ELECTRON MICROSCOPY; VENEERS; X RAY SPECTROSCOPY;

EID: 84906048559     PISSN: None     EISSN: 19302126     Source Type: Journal    
DOI: 10.15376/biores.9.2.2949-2959     Document Type: Article

References (31)

1. Abdel Aal, A., and Shehata Aly, M. (2009). “Electroless Ni-Cu-P plating onto open cell stainless steel foam,” Appl. Surf. Sci. 255(13), 6652-6655.
2. Armyanov, S., Georgieva, J., Tachev, D., Valova, E., Nyagolova, N., Mehta, S., Leibman, D., and Ruffini, A. (1999). “Electroless deposition of Ni-Cu-P alloys in acidic solutions,” Electrochem. Solid State Lett. 2(7), 323-325.
3. Ashassi-Sorkhabi, H., Dolati, H., Parvini-Ahmadi, N., and Manzoori, J. (2002). “Electroless deposition of Ni-Cu-P alloy and study of the influences of some parameters on the properties of deposits,” Appl. Surf. Sci. 185(3), 155-160.
4. Gao, G. Q., and Huang, J. T. (2007). “The effect factor analysis of the nickel activation techniques on the uniformity of the plating layer in wood electroless nickel plating,” J. Inner Mongolia Agric. Univ. 28, 95-98.
5. Guo, R. H., Jiang, S. Q., Yuen, C. W. M., and Ng, M. C. F. (2009). “Effect of copper content on the properties of Ni-Cu-P plated polyester fabric,” J. Appl. Electrochem. 39(6), 907-912.
6. Hu, G. H., Wu, H. H., and Yang, F. Z. (2006). “Electroless nickel plating on carbon nanotube with non-palladium activation process,” Electrochemistry 12(1), 25-28.
7. Huang, J. T., and Zhao, G. J. (2004). “Electroless plating of wood,” J. Beijing For. Univ. 3, 88-92.
8. Krasteva, N., Fotty, V., and Armyanov, S. (1994). “Thermal stability of Ni-P and Ni-CuP amorphous alloys,” J. Electrochem. Soc. 141(10), 2864-2867.
9. Lai, D. Z., Chen, W. X., Yao, Y. F., and Liu, G. F. (2006). “Novel activation method using chemical plating on the fabric,” J. Textile. Res. 27(1), 34-37.
10. Li, L. B., An, M. Z., and Wu, G. H. (2006). “A new electroless nickel deposition technique to metallise SiCp/Al composites,” Surf. Coat. Technol. 200(16), 51025112.
11. Li, L. B., and An, M. Z. (2008). “Electroless nickel-phosphorus plating on SiCp/Al composite from acid bath with nickel activation,” J. Alloy. Compd. 461(1), 85-91.
12. Liu, H. B., Li, J., and Wang, L. J. (2010). “Electroless nickel plating on APTHS modified wood veneer for EMI shielding,” Appl. Surf. Sci. 257(4), 1325-1330.
13. Liu, Y., and Zhao, Q. (2004). “Study of electroless Ni-Cu-P coatings and their anticorrosion properties,” Appl. Surf. Sci. 228(1), 57-62.
14. Nagasawa, C., Kumagai, Y., and Urabe, K. (1991). “Electro-conductivity and electromagnetic shielding effectiveness of nickel-plated veneer,” J. Wood Sci. 37(2), 158-163.
15. Nagasawa, C., Kumagai, Y., and Urabe, K. (1990). “Electromagnetic shielding effectiveness particles board containing nickel-metalized wood particles in the core layer,” J. Wood Sci. 36(7), 531-537.
16. Nagasawa, C., Kumagai, Y., Koshizaki, N., and Kanbe, T. (1992). “Changes in electromagnetic shielding properties of particlesboards made of nickel-plated wood particles formed by various pre-treatment processes,” J. Wood Sci. 38(3), 256-263.
17. Nagasawa, C., Kumagai, Y., Urabe, K., and Shinagawa, S. (1999). “Electromagnetic shielding particle board with nickel-plated wood particles,” J. Porous Mater. 6(3), 247-254.
18. Ranganatha, S., Venkatesha, T. V., and Vathsala, K. (2012). “Process and properties of electroless Ni-Cu-P-ZrO2 nanocomposite coatings,” Mater. Res. Bull. 47(3), 635-645.
19. Shao, Q., Yang, Y. X., Ge, S. S., and Zheng, H. (2007). “Study on electroless nickel plating activated without palladium on the surface of cenospheres,” J. Func. Mater. 38(12), 2001.
20. Srinivasan, K. N., and John, S. (2009). “Electroless nickel deposition from methane sulfonate bath,” J. Alloy. Compd. 486(1), 447-450.
21. Sun, L. L., Li, J., and Wang, L. J. (2012). “Electromagnetic interference shielding material from electroless copper plating on birch veneer,” Wood Sci. Technol. 46(6), 1061-1071.
22. Tang, X. J., Bi, C. L., Han, C. X., and Zhang, B. G. (2009). “A new palladium-free surface activation process for Ni electroless plating on ABS plastic,” Mater. Lett. 63(11), 840-842.
23. Wang, L. J., Li, J., and Liu, Y. X. (2006a). “Electroless nickel plating on poplar veneer,” Fine. Chem. 23(3), 230-233.
24. Wang, L. J., Li, J., and Liu, Y. X. (2006b). “Preparation of electromagnetic shielding wood-metal composite by electroless nickel plating,” J. For. Res. 17(1), 53-56.Wang, L. J., and Li, J. (2007a). “Electroless deposition of Ni-Cu-P alloy on Fraxinus mandshurica veneer,” Sci. Silv. Sinica. 43, 89-92.
25. Wang, L. J., and Li, J. (2007b). “Ultrasound-assisted electroless plating Ni-P alloy on the surface of birch veneer,” Sci. Silv. Sinica. 12, 311-315.
26. Wang, L. J., Li, J., and Liu, Y. X. (2008). “Study on preparation of electromagnetic shielding composite by electroless copper plating on Fraxinus mandshurica veneer,” J. Mater. Eng. (4), 56-60.
27. Wang, L. J., Li, J., and Liu, H. B. (2011a). “A simple process for electroless plating nickel-phosphorus film on wood veneer,” Wood Sci. Technol. 45(1), 161-167.
28. Wang, L. J., Sun, L. L., and Li, J. (2011b). “Electroless copper plating on Fraxinus mandshurica veneer using glyoxylic acid as reducing agent,” BioResources 6(3), 3493-3504.
29. Wang, L. J., and Liu, H. B. (2011c). “Electroless nickel plating on chitosan-modified wood veneer,” BioResources 6(2), 2045-2054.
30. Wu, R. W., Lin, Y., Lin, Z. R., and Gan, J. Z. (2002). “Study on polymer magnetic composites for shielding electromagnetic interference (EMI),” J. Func. Mater. 33(5), 492-494.
31. Yang, L., Li, J., Zheng, Y., Jiang, W., and Zhang, M. (2009). “Electroless Ni-P plating with molybdate pretreatment on Mg-8Li alloy,” J. Alloy. Compd. 467(1), 562-566.