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Volumn 46, Issue 6, 2012, Pages 1061-1071

Electromagnetic interference shielding material from electroless copper plating on birch veneer

Author keywords

[No Author keywords available]

Indexed keywords

COPPER COATINGS; COPPER FILMS; CRYSTALLINE STRUCTURE; ELECTROLESS COPPER PLATING; ELECTROMAGNETIC INTERFERENCE SHIELDING MATERIALS; ELECTROMAGNETIC SHIELDING EFFECTIVENESS; METAL DEPOSITION; PLATING BATH; SEM-EDS; SURFACE RESISTIVITY; WOOD SURFACES; XRD;

EID: 84869045373     PISSN: 00437719     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00226-012-0466-y     Document Type: Article
Times cited : (26)

References (27)
  • 1
    • 13644262990 scopus 로고    scopus 로고
    • Heterogeneous catalysis on chitosan-based materials: A review
    • DOI 10.1016/j.progpolymsci.2004.12.001, PII S007967000500002X
    • Guibal E (2005) Heterogeneous catalysis on chitosan-based materials: a review. Prog Polym Sci 30:71-109 (Pubitemid 40225755)
    • (2005) Progress in Polymer Science (Oxford) , vol.30 , Issue.1 , pp. 71-109
    • Guibal, E.1
  • 3
    • 56949097878 scopus 로고    scopus 로고
    • Electroless ni-b plating on sio2 with 3-aminopropyltriethoxysilane as a barrier layer against cu diffusion for through-si via interconnections in a 3-dimensional multi-chip package
    • Ikeda A, Sakamoto A, Hattori R, Kuroki Y (2009) Electroless Ni-B plating on SiO2 with 3-aminopropyltriethoxysilane as a barrier layer against Cu diffusion for through-Si via interconnections in a 3-dimensional multi-chip package. Thin Solid Films 517:1740-1745
    • (2009) Thin Solid Films , vol.517 , pp. 1740-1745
    • Ikeda, A.1    Sakamoto, A.2    Hattori, R.3    Kuroki, Y.4
  • 4
    • 70849105287 scopus 로고    scopus 로고
    • A new process for preparing conducting wood veneers by electroless nickel plating
    • Li J, Wang LJ, Liu HB (2010) A new process for preparing conducting wood veneers by electroless nickel plating. Surf Coat Technol 204:1200-1205
    • (2010) Surf Coat Technol , vol.204 , pp. 1200-1205
    • Li, J.1    Wang, L.J.2    Liu, H.B.3
  • 5
    • 77956073703 scopus 로고    scopus 로고
    • Electroless nickel deposition on fraxinus mandshurica veneer modified with apths for emi shielding
    • Liu HB, Wang LJ (2010) Electroless nickel deposition on Fraxinus Mandshurica veneer modified with APTHS for EMI shielding. BioResources 5:2040-2050
    • (2010) BioResources , vol.5 , pp. 2040-2050
    • Liu, H.B.1    Wang, L.J.2
  • 6
  • 7
    • 77957153110 scopus 로고    scopus 로고
    • Electroless nickel plating on apths modified wood veneer for emi shielding
    • Liu HB, Li J, Wang LJ (2010) Electroless nickel plating on APTHS modified wood veneer for EMI shielding. Appl Surf Sci 257:1325-1330
    • (2010) Appl Surf Sci , vol.257 , pp. 1325-1330
    • Liu, H.B.1    Li, J.2    Wang, L.J.3
  • 8
    • 67650481356 scopus 로고    scopus 로고
    • Electroless copper plating on 3-mercaptopropyltriethoxysilane modified pet fabric challenged by ultrasonic washing
    • Lu YX (2009) Electroless copper plating on 3- mercaptopropyltriethoxysilane modified PET fabric challenged by ultrasonic washing. Appl Surf Sci 255:8430-8434
    • (2009) Appl Surf Sci , vol.255 , pp. 8430-8434
    • Lu, Y.X.1
  • 9
    • 77649187903 scopus 로고    scopus 로고
    • Improvement of copper plating adhesion on silane modified pet film by ultrasonicassisted electroless deposition
    • Lu YX (2010) Improvement of copper plating adhesion on silane modified PET film by ultrasonicassisted electroless deposition. Appl Surf Sci 256:3554-3558
    • (2010) Appl Surf Sci , vol.256 , pp. 3554-3558
    • Lu, Y.X.1
  • 10
    • 70849087893 scopus 로고
    • Electromagnetic shielding particleboards with nickel-plated wood particle
    • Nagasawa C, Kumagai Y (1989) Electromagnetic shielding particleboards with nickel-plated wood particle. J Wood Sci 35:1092-1099
    • (1989) J Wood Sci , vol.35 , pp. 1092-1099
    • Nagasawa, C.1    Kumagai, Y.2
  • 11
    • 1542537801 scopus 로고
    • Electromagnetic shielding effectiveness particles board containing nickel-metalized wood particles in the core layer
    • Nagasawa C, Kumagai Y, Urabe K (1990) Electromagnetic shielding effectiveness particles board containing nickel-metalized wood particles in the core layer. J Wood Sci 36:531-537
    • (1990) J Wood Sci , vol.36 , pp. 531-537
    • Nagasawa, C.1    Kumagai, Y.2    Urabe, K.3
  • 12
    • 1542642685 scopus 로고
    • Electro-conductivity and electromagnetic shielding effectiveness of nickel-plated veneer
    • Nagasawa C, Kumagai Y, Urabe K (1991a) Electro-conductivity and electromagnetic shielding effectiveness of nickel-plated veneer. J Wood Sci 37:158-163
    • (1991) J Wood Sci , vol.37 , pp. 158-163
    • Nagasawa, C.1    Kumagai, Y.2    Urabe, K.3
  • 13
    • 70849133776 scopus 로고
    • Effects of wood species on electroconductivity and electromagnetic shielding properties of electrolessly plated sliced veneer with nickel
    • Nagasawa C, Umehara H, Koshizaki N (1991b) Effects of wood species on electroconductivity and electromagnetic shielding properties of electrolessly plated sliced veneer with nickel. J Wood Sci 40:1092-1099
    • (1991) J Wood Sci , vol.40 , pp. 1092-1099
    • Nagasawa, C.1    Umehara, H.2    Koshizaki, N.3
  • 14
    • 1542642668 scopus 로고
    • Changes in electromagnetic shielding properties of particleboards made of nickel-plated wood particles formed by various pre-treatment processes
    • Nagasawa C, Kumagai Y, Koshizaki N, Kanbe T (1992) Changes in electromagnetic shielding properties of particleboards made of nickel-plated wood particles formed by various pre-treatment processes. J Wood Sci 38:256-263
    • (1992) J Wood Sci , vol.38 , pp. 256-263
    • Nagasawa, C.1    Kumagai, Y.2    Koshizaki, N.3    Kanbe, T.4
  • 15
    • 0032665221 scopus 로고    scopus 로고
    • Electromagnetic shielding particle board with nickel-plated wood particles
    • Nagasawa C, Kumagai Y, Urabe K, Shinagawa S (1999) Electromagnetic shielding particle board with nickel-plated wood particles. J Porous Mater 6:247-254
    • (1999) J Porous Mater , vol.6 , pp. 247-254
    • Nagasawa, C.1    Kumagai, Y.2    Urabe, K.3    Shinagawa, S.4
  • 16
    • 67349131901 scopus 로고    scopus 로고
    • Chitin and chitosan polymers: Chemistry, solubility and fiber formation
    • Pillai CKS, Paul W, Sharma CP (2009) Chitin and chitosan polymers: chemistry, solubility and fiber formation. Prog Polym Sci 34:641-678
    • (2009) Prog Polym Sci , vol.34 , pp. 641-678
    • Pillai, C.K.S.1    Paul, W.2    Sharma, C.P.3
  • 17
    • 80051567744 scopus 로고    scopus 로고
    • Chitosan based hydrogel polymeric beads -As drug delivery system
    • Rani M, Agarwal A, Negi YS (2010) Chitosan based hydrogel polymeric beads -as drug delivery system. BioResources 4:2765-2807
    • (2010) BioResources , vol.4 , pp. 2765-2807
    • Rani, M.1    Agarwal, A.2    Negi, Y.S.3
  • 18
    • 44649192957 scopus 로고    scopus 로고
    • Palladium adsorbing properties of uv-curable chitosan derivatives and surface analysis of chitosan-containing paint
    • Renbutsu E, Okabe S, Omura Y (2008) Palladium adsorbing properties of UV-curable chitosan derivatives and surface analysis of chitosan-containing paint. Int J Biol Macromol 43:62-68
    • (2008) Int J Biol Macromol , vol.43 , pp. 62-68
    • Renbutsu, E.1    Okabe, S.2    Omura, Y.3
  • 19
    • 80051564054 scopus 로고    scopus 로고
    • Study on the preparation technology of timber-metal composite materials
    • Sun B, Wang ZX (2008) Study on the preparation technology of timber-metal composite materials. J Zhongyuan Univ Technol 6:23-25
    • (2008) J Zhongyuan Univ Technol , vol.6 , pp. 23-25
    • Sun, B.1    Wang, Z.X.2
  • 20
    • 37349115517 scopus 로고    scopus 로고
    • Research on a new surface activation process for electroless plating on ABS plastic
    • DOI 10.1016/j.matlet.2007.07.055, PII S0167577X07007732
    • Tang XJ, Cao M, Bi CL, Yan LJ, Zhang BG (2008) Research on a new surface activation process for electroless plating on ABS plastic. Mater Lett 62:1089-1091 (Pubitemid 350299579)
    • (2008) Materials Letters , vol.62 , Issue.6-7 , pp. 1089-1091
    • Tang, X.1    Cao, M.2    Bi, C.3    Yan, L.4    Zhang, B.5
  • 21
    • 77956075922 scopus 로고    scopus 로고
    • Electroless deposition of ni-cu-p alloy on fraxinus mandshurica veneer
    • Wang LJ, Li J (2007) Electroless deposition of Ni-Cu-P alloy on Fraxinus mandshurica veneer. Sci Silv Sinica 11:89-92
    • (2007) Sci Silv Sinica , vol.11 , pp. 89-92
    • Wang, L.J.1    Li, J.2
  • 22
    • 0037202047 scopus 로고    scopus 로고
    • Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine
    • Wang WC, Kang ET, Neoh KG (2002) Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine. Appl Surf Sci 199:52-66
    • (2002) Appl Surf Sci , vol.199 , pp. 52-66
    • Wang, W.C.1    Kang, E.T.2    Neoh, K.G.3
  • 23
    • 64249083018 scopus 로고    scopus 로고
    • Electroless nickel plating on poplar veneer
    • Wang LJ, Li J, Liu YX (2006a) Electroless nickel plating on poplar veneer. Fine Chem 3:230-233
    • (2006) Fine Chem , vol.3 , pp. 230-233
    • Wang, L.J.1    Li, J.2    Liu, Y.X.3
  • 24
    • 55849126285 scopus 로고    scopus 로고
    • Preparation of electromagnetic shielding wood-metal composite by electroless nickel plating
    • Wang LJ, Li J, Liu YX (2006b) Preparation of electromagnetic shielding wood-metal composite by electroless nickel plating. J For Res 17:53-56
    • (2006) J For Res , vol.17 , pp. 53-56
    • Wang, L.J.1    Li, J.2    Liu, Y.X.3
  • 25
    • 43749090803 scopus 로고    scopus 로고
    • Study on preparation of electromagnetic shielding composite by electroless copper plating on fraxinus mandshurica veneer
    • Wang LJ, Li J, Liu YX (2008) Study on preparation of electromagnetic shielding composite by electroless copper plating on Fraxinus mandshurica veneer. J Mater Eng 4:56-60 (Pubitemid 351687684)
    • (2008) Cailiao Gongcheng/Journal of Materials Engineering , Issue.4 , pp. 56-60
    • Wang, L.-J.1    Li, J.2    Liu, Y.-X.3
  • 26
    • 79751526584 scopus 로고    scopus 로고
    • A simple process for electroless plating nickel-phosphorus film on wood veneer
    • Wang LJ, Li J, Liu HB (2011) A simple process for electroless plating nickel-phosphorus film on wood veneer. Wood Sci Technol 45:61-167
    • (2011) Wood Sci Technol , vol.45 , pp. 61-167
    • Wang, L.J.1    Li, J.2    Liu, H.B.3
  • 27
    • 78650876315 scopus 로고    scopus 로고
    • Preparation of conductive wool fabrics and adsorption behaviour of pd (ii) ions on chitosan in the pre-treatment
    • Yu D, Wang W, Wu JW (2011) Preparation of conductive wool fabrics and adsorption behaviour of Pd (II) ions on chitosan in the pre-treatment. Synth Met 161:124-131
    • (2011) Synth Met , vol.161 , pp. 124-131
    • Yu, D.1    Wang, W.2    Wu, J.W.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.