Electroless copper plating on Fraxinus mandshurica veneer using glyoxylic acid as reducing agent

BioResources

Volumn 6, Issue 3, 2011, Pages 3493-3504

  Wang, Lijuan ^a   Sun, Lili ^a   Li, Jian ^a  

^a NORTHEAST FORESTRY UNIVERSITY   (China)

Author keywords

Chitosan pretreatment; Electroless copper plating; Electromagnetic shielding; Fraxinus mandshurica veneers; Pd (II) activation

Indexed keywords

ACTIVATION PROCESS; CHITOSAN MEMBRANE; COORDINATION BONDS; COPPER COATINGS; COPPER DEPOSITION; COPPER FILMS; CRYSTALLINE STRUCTURE; ELECTROLESS COPPER PLATING; ELECTROMAGNETIC SHIELDING EFFECTIVENESS; EMI SHIELDING; FRAXINUS MANDSHURICA VENEERS; FREQUENCY RANGING; GLYOXYLIC ACIDS; METAL DEPOSITION; PLATING BATH; PRE-TREATMENT; SEM-EDS; SURFACE RESISTIVITY; WOOD GRAINS; WOOD SURFACES; WOOD VENEER; XRD;

CHITOSAN; COATINGS; COPPER; COPPER PLATING; ELECTROLESS PLATING; ELECTROMAGNETISM; ELECTROPLATING; MAGNETIC SHIELDING; PALLADIUM; PALLADIUM COMPOUNDS; SURFACE STRUCTURE; VENEERS; WOOD; X RAY PHOTOELECTRON SPECTROSCOPY;

ELECTROMAGNETIC SHIELDING;

CHITOSAN; COATINGS; COPPER; ESCA; FRAXINUS MANDSHURICA; PALLADIUM; PALLADIUM COMPOUNDS; PLATING; SURFACE RESISTIVITY; VENEERS; WOOD; X RAY SPECTROSCOPY;

FRAXINUS; FRAXINUS MANDSHURICA;

EID: 80051566464     PISSN: None     EISSN: 19302126     Source Type: Journal    
DOI: None     Document Type: Article

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