Electroless Ni-Cu-P plating onto open cell stainless steel foam

Applied Surface Science

Volumn 255, Issue 13-14, 2009, Pages 6652-6655

  Abdel Aal, A ^a,b   Shehata Aly, M ^c  

^a CNRS   (France)

^b CENTRAL METALLURGICAL RESEARCH AND DEVELOPMENT INSTITUTE CMRDI   (Egypt)

^c KING SAUD UNIVERSITY   (Saudi Arabia)

Author keywords

Coatings; Corrosion; Electroless plating; Foams; Stainless steel

Indexed keywords

CHEMICAL ANALYSIS; CHLORINE COMPOUNDS; COATINGS; COPPER COMPOUNDS; COPPER CORROSION; CORROSION; CORROSION RESISTANCE; DEPOSITION RATES; DEPOSITS; ELECTROLESS PLATING; FOAMS; HEAVY IONS; SCANNING ELECTRON MICROSCOPY; STEEL CORROSION;

CHEMICAL COMPOSITIONS; CORROSION PERFORMANCE; DEPOSITED COATINGS; ENERGY DISPERSIVE ANALYSIS; ENGINEERING APPLICATIONS; HIGH-ENERGY ABSORPTION; INDUSTRIAL UTILIZATION; ULTRA LIGHTWEIGHTS;

STAINLESS STEEL;

EID: 63649092079     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2009.02.073     Document Type: Article

References (28)

1. Shirzadi A., Kocak M., and Wallach E. Sci. Technol. Weld. Joining 9 (2004) 277
2. Baumeister J., Banhart J., and Weber M. Mater. Design 18 (1997) 217
3. Davies G.J., and Zhen S. J. Mater. Sci. 18 (1983) 1899
4. Cellular metals and metal foaming technology. In: Banhart J., Ashby M.F., and Fleck N.A. (Eds). 2nd International Conference (MetFoam2001). Bremen, Germany (2001)
5. Gibson L., and Ashby M. Cellular Solids-Structure and Properties. 2nd ed. (1997), Cambridge University Press, Cambridge, UK
6. Banhart J. Progr. Mater. Sci. 46 (2001) 559
7. Banhart J., and Weaire D. Phys. Today 55 (2002) 37-42
8. Chen C.J., and Lin K.L. Thin Solid Films 370 (2000) 106
9. Lee C.Y., and Lin K.L. Jpn. J. Appl. Phys. Part 1 33 (1994) 4708
10. Hur K.H., Jeong J.H., and Lee D.N. J. Mater. Sci. 26 (1991) 2037
11. Nawafune H., Uegaki T., Mizumoto S., Ishikawa M., and Nakamura T. Trans. IMF 76 (1998) 231
12. Saeid T., Yazdani S., and Ahmadi N. Surf. Coat. Technol. 200 (2006) 5789
13. Armyanov S., Georgieva J., Tachev D., Valova E., Nyagolova N., Mehta S., Leibman D., and Ruffini A. Electrochem. Solid-State Lett. 2 (1999) 323
14. Krasteva N., Fotly V., and Armyanov S. J. Electrochem. Soc. 141 (1994) 2864
15. Georgieva J., and Armyanov S. J. Electrochem. Soc. 150 (2003) 760
16. Georgieva J., and Armyanov S. J. Solid State Electrochem. 11 (2007) 869
17. Valova E., Dille J., Armyanov S., Georgieva J., Tatchev D., Marinov M., Delplancke J.-L., Steenhaut O., and Hubin A. Surf. Coat. Technol. 190 (2005) 336
18. Hsu J.-C., and Lin K.-L. Thin Solid Films 471 (2005) 186
19. Zhao Q., Liu Y., and Abel E.W. Mater. Chem. Phys. 87 (2004) 332
20. Zhao Q., and Liu Y. Appl. Surf. Sci. 229 (2004) 56
21. Subhash G., Liu Q., and Lin X. Int. J. Impact Eng. 32 (2006) 1113
22. Liu Y., and Zhao Q. Appl. Surf. Sci. 228 (2004) 57
23. Chen C., Chen B., and Hong L. Chem. Mater. 18 (2006) 2959
24. Yin X., Hong L., Chen B., and Ko T. J. Colloid Interface Sci. 262 (2003) 89
25. Yin X., Hong L., and Chen B. J. Phys. Chem. B 108 (2004) 10919
26. Mallory G.O., and Hajdu J.B. Electroless Plating: Fundamentals and Applications (1990), American Electroplaters and Surface Finish Society, Orlando, FL
27. Bard A., and Faulkner L. Electrochemical Methods: Fundamentals and Applications (2001), John Wiley & Sons, New York
28. Balaraju J.N., and Rajam K.S. Surf. Coat. Technol. 195 (2005) 154